JPS6433735U - - Google Patents
Info
- Publication number
- JPS6433735U JPS6433735U JP12820687U JP12820687U JPS6433735U JP S6433735 U JPS6433735 U JP S6433735U JP 12820687 U JP12820687 U JP 12820687U JP 12820687 U JP12820687 U JP 12820687U JP S6433735 U JPS6433735 U JP S6433735U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- bushing material
- component element
- lead wire
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 3
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Insulators (AREA)
Description
第１図はこの考案の一実施例を示す電子部品の
断面図、第２図はこの考案のブツシング材の構造
図、第３図は従来の電子部品を示す断面図である
。
図中、１は円筒型金属ケース、２はリード、３
はコンデンサ素子、４はリード２とコンデンサ素
子３の接続部、５はブツシング材、６はカシメ部
、７は貫通孔、８はＵ字型曲げリード、９はブツ
シング溝である。なお、図中、同一又は相当部分
には同一符号を付して示してある。
FIG. 1 is a sectional view of an electronic component showing an embodiment of this invention, FIG. 2 is a structural diagram of a bushing material of this invention, and FIG. 3 is a sectional view of a conventional electronic component. In the figure, 1 is a cylindrical metal case, 2 is a lead, and 3 is a cylindrical metal case.
1 is a capacitor element, 4 is a connecting portion between the lead 2 and capacitor element 3, 5 is a bushing material, 6 is a caulked portion, 7 is a through hole, 8 is a U-shaped bent lead, and 9 is a bushing groove. In the drawings, the same or corresponding parts are designated by the same reference numerals.
Claims (1)
、上記電子部品素子を上記パツケージ内に密封す
るとともに上記電子部品素子のリード線を導き外
部へ引出す貫通孔を有するブツシング材と、上記
ブツシング材とリード線を密着し、かつ上記電子
部品素子を固定する手段とを備えた電子部品にお
いて、上記リード線の上記ブツシング材と接する
部分をＵ字状に形成し、かつ上記Ｕ字状に形成し
た部分がはまり込む溝を上記ブツシング材に設け
たことを特徴とする電子部品。 An electronic component element provided in a hollow package; a bushing material that seals the electronic component element within the package and has a through hole for guiding a lead wire of the electronic component element to the outside; and the bushing material and the lead wire. and a means for fixing the electronic component element, wherein a portion of the lead wire that contacts the bushing material is formed into a U-shape, and the U-shaped portion is fitted into the electronic component. An electronic component characterized in that the bushing material is provided with a groove for insertion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12820687U JPS6433735U (en) | 1987-08-24 | 1987-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12820687U JPS6433735U (en) | 1987-08-24 | 1987-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6433735U true JPS6433735U (en) | 1989-03-02 |
Family
ID=31381324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12820687U Pending JPS6433735U (en) | 1987-08-24 | 1987-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6433735U (en) |
-
1987
- 1987-08-24 JP JP12820687U patent/JPS6433735U/ja active Pending
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