JPS6435736U - - Google Patents

Info

Publication number
JPS6435736U
JPS6435736U JP13077387U JP13077387U JPS6435736U JP S6435736 U JPS6435736 U JP S6435736U JP 13077387 U JP13077387 U JP 13077387U JP 13077387 U JP13077387 U JP 13077387U JP S6435736 U JPS6435736 U JP S6435736U
Authority
JP
Japan
Prior art keywords
lead content
electronic component
solder
lead
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13077387U
Other languages
Japanese (ja)
Other versions
JPH0427151Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987130773U priority Critical patent/JPH0427151Y2/ja
Publication of JPS6435736U publication Critical patent/JPS6435736U/ja
Application granted granted Critical
Publication of JPH0427151Y2 publication Critical patent/JPH0427151Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す断面図、第２
図は本考案の要部を示す部分拡大断面図である。
第３図及び第４図は、従来の半田メツキが施され
た電子部品の一例を示す断面図である。 ２０……電子部品、２５……リード部材、２６
……半田メツキ、２６ａ……半田層、２６ｂ……
酸化防止層。 Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a partially enlarged sectional view showing the main parts of the present invention.
FIGS. 3 and 4 are cross-sectional views showing an example of an electronic component subjected to conventional solder plating. 20...Electronic component, 25...Lead member, 26
...Solder plating, 26a...Solder layer, 26b...
Antioxidant layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品のリード部材及び電極に、鉛含有率８
０〜１００％の半田層を形成した上に、鉛含有率
０〜２０％の半田或いは錫からなる薄膜を酸化防
止層として積層形成したことを特徴とする電子部
品。 Lead content in electronic component lead members and electrodes is 8.
An electronic component characterized in that a solder layer with a lead content of 0 to 100% is formed, and a thin film of solder or tin with a lead content of 0 to 20% is laminated as an oxidation prevention layer.
JP1987130773U 1987-08-27 1987-08-27 Expired JPH0427151Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987130773U JPH0427151Y2 (en) 1987-08-27 1987-08-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987130773U JPH0427151Y2 (en) 1987-08-27 1987-08-27

Publications (2)

Publication Number Publication Date
JPS6435736U true JPS6435736U (en) 1989-03-03
JPH0427151Y2 JPH0427151Y2 (en) 1992-06-30

Family

ID=31386240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987130773U Expired JPH0427151Y2 (en) 1987-08-27 1987-08-27

Country Status (1)

Country Link
JP (1) JPH0427151Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6468007A (en) * 1987-09-08 1989-03-14 Matsushima Kogyo Kk Piezoelectric vibrator
WO1998023028A1 (en) * 1996-11-19 1998-05-28 Miyota Co., Ltd. Piezoelectric vibrator
JP2012100251A (en) * 2010-10-08 2012-05-24 Nippon Dempa Kogyo Co Ltd Crystal oscillator with thermostat, and method for manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59188147A (en) * 1983-04-08 1984-10-25 Mitsubishi Electric Corp Semiconductor device and manufacture thereof
JPS61168161U (en) * 1985-04-08 1986-10-18

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59188147A (en) * 1983-04-08 1984-10-25 Mitsubishi Electric Corp Semiconductor device and manufacture thereof
JPS61168161U (en) * 1985-04-08 1986-10-18

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6468007A (en) * 1987-09-08 1989-03-14 Matsushima Kogyo Kk Piezoelectric vibrator
WO1998023028A1 (en) * 1996-11-19 1998-05-28 Miyota Co., Ltd. Piezoelectric vibrator
JP2012100251A (en) * 2010-10-08 2012-05-24 Nippon Dempa Kogyo Co Ltd Crystal oscillator with thermostat, and method for manufacturing the same

Also Published As

Publication number Publication date
JPH0427151Y2 (en) 1992-06-30

Similar Documents

Publication Publication Date Title
JPS59132628U (en) wet electrolytic capacitor
JPS5935230U (en) Composite contact wire
JPS617583U (en) conductive gold and silver thread
JPS58124936U (en) Chip-shaped electronic components
JPS5917399U (en) Aerosol can with an opening tab
JPS63119227U (en)
JPS61192497U (en)
JPS6033403U (en) barista
JPS6315033U (en)
JPS6051821U (en) conductive adhesive tape
JPS60176535U (en) capacitor
JPS5966059U (en) Pulley for timing belt
JPS61195098U (en)
JPS5811894U (en) External lead connection structure of electroluminescent lamp
JPS6030503U (en) barista
JPS59170224U (en) instrument case
JPS58140645U (en) IC lead frame
JPS59177935U (en) Composite film for the exterior of electrolytic capacitors
JPS61164012U (en)
JPS5914330U (en) Capacitor terminal structure
JPS62163918U (en)
JPS63188956U (en)
JPS63140696U (en)
JPS5958928U (en) Mounting structure of solder capacitor
JPS58133862U (en) microcomputer card