JPS6435788U - - Google Patents
Info
- Publication number
- JPS6435788U JPS6435788U JP12924387U JP12924387U JPS6435788U JP S6435788 U JPS6435788 U JP S6435788U JP 12924387 U JP12924387 U JP 12924387U JP 12924387 U JP12924387 U JP 12924387U JP S6435788 U JPS6435788 U JP S6435788U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- mounting structure
- plate
- bottom wall
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案のセラミツク基板の実装構造の
実施例の概略斜視図、第２図はセラミツク基板を
パツケージ底壁に直接実装した状態を示す断面図
、第３図は本考案である用いる波形板の他の実施
例の斜視図、第４図は従来のセラミツク基板の実
装構造の一例を示す概略斜視図である。
１０……セラミツク基板、１２……金属板、１
３……チツプ部品、１５……波形板、１６……パ
ツケージ、１７……スリツト。
Fig. 1 is a schematic perspective view of an embodiment of the ceramic substrate mounting structure of the present invention, Fig. 2 is a sectional view showing the ceramic substrate mounted directly on the bottom wall of the package, and Fig. 3 is the waveform used in the present invention. A perspective view of another embodiment of the plate, and FIG. 4 is a schematic perspective view showing an example of a conventional mounting structure of a ceramic substrate. 10... Ceramic substrate, 12... Metal plate, 1
3... Chip parts, 15... Corrugated plate, 16... Package, 17... Slit.
Claims (1)
ツク基板１０を金属製パツケージ１６の底壁上又
は金属板１２上に実装したことを特徴とするセラ
ミツク基板の実装構造。 A ceramic substrate mounting structure characterized in that a ceramic substrate 10 is mounted on the bottom wall of a metal package 16 or on a metal plate 12 via a corrugated plate 15 made of an elastic conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12924387U JPS6435788U (en) | 1987-08-27 | 1987-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12924387U JPS6435788U (en) | 1987-08-27 | 1987-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6435788U true JPS6435788U (en) | 1989-03-03 |
Family
ID=31383339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12924387U Pending JPS6435788U (en) | 1987-08-27 | 1987-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6435788U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2426748A1 (en) | 2010-09-07 | 2012-03-07 | Kabushiki Kaisha Toyota Jidoshokki | Semiconductor unit |
-
1987
- 1987-08-27 JP JP12924387U patent/JPS6435788U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2426748A1 (en) | 2010-09-07 | 2012-03-07 | Kabushiki Kaisha Toyota Jidoshokki | Semiconductor unit |