JPS6435841A - High-dose ion implanter - Google Patents

High-dose ion implanter

Info

Publication number
JPS6435841A
JPS6435841A JP62190466A JP19046687A JPS6435841A JP S6435841 A JPS6435841 A JP S6435841A JP 62190466 A JP62190466 A JP 62190466A JP 19046687 A JP19046687 A JP 19046687A JP S6435841 A JPS6435841 A JP S6435841A
Authority
JP
Japan
Prior art keywords
chamber
gas
ion
arc
ash3
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62190466A
Other languages
Japanese (ja)
Inventor
Shiro Iwamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP62190466A priority Critical patent/JPS6435841A/en
Publication of JPS6435841A publication Critical patent/JPS6435841A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To capture and remove the unnecessary gas with an adsorbent, guiding only the necessary gas to an arc chamber, and obtain a high-dose ion implanting apparatus by inserting a gas decomposition chamber and a chamber filled with the adsorbent between a gas cylinder and the arc chamber. CONSTITUTION:AsH3 is guided to a decomposition chamber 8 from a gas cylinder, plasma is generated across electrodes 8a, 8b, and AsH3 is decomposed into As and H2. 90% or more of unnecessary H2 is captured by a Pt alloy 9a in an adsorption chamber 9, and the As gas is guided to the ion generation chamber 25 of an arc chamber 2 through a line 3. A filament 27 is excited to cause an arc discharge, As is ionized, the ionization is accelerated by the magnetic field of a magnet 26, and the ion density is increased. As ions are extracted by an electrode through a slit section 25 to form an ion beam A. The ion mass and charged quantity of the beam A are analyzed and detected by a detector, and the required ion beam thus obtained is implanted into a wafer. No solid source heating device is required, pollution is prevented, and the beam is smoothly stabilized.
JP62190466A 1987-07-31 1987-07-31 High-dose ion implanter Pending JPS6435841A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62190466A JPS6435841A (en) 1987-07-31 1987-07-31 High-dose ion implanter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62190466A JPS6435841A (en) 1987-07-31 1987-07-31 High-dose ion implanter

Publications (1)

Publication Number Publication Date
JPS6435841A true JPS6435841A (en) 1989-02-06

Family

ID=16258582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62190466A Pending JPS6435841A (en) 1987-07-31 1987-07-31 High-dose ion implanter

Country Status (1)

Country Link
JP (1) JPS6435841A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100809138B1 (en) * 2004-05-14 2008-02-29 닛신 이온기기 가부시기가이샤 Ion implanting apparatus
WO2008136858A3 (en) * 2006-11-08 2009-04-30 Varian Semiconductor Equipment Techniques for removing molecular fragments from an ion implanter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100809138B1 (en) * 2004-05-14 2008-02-29 닛신 이온기기 가부시기가이샤 Ion implanting apparatus
WO2008136858A3 (en) * 2006-11-08 2009-04-30 Varian Semiconductor Equipment Techniques for removing molecular fragments from an ion implanter

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