JPS6437386A - Semiconductor receiving tube - Google Patents

Semiconductor receiving tube

Info

Publication number
JPS6437386A
JPS6437386A JP62189361A JP18936187A JPS6437386A JP S6437386 A JPS6437386 A JP S6437386A JP 62189361 A JP62189361 A JP 62189361A JP 18936187 A JP18936187 A JP 18936187A JP S6437386 A JPS6437386 A JP S6437386A
Authority
JP
Japan
Prior art keywords
semiconductors
main body
tube main
projections
lid body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62189361A
Other languages
Japanese (ja)
Inventor
Tsuneo Fukunishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62189361A priority Critical patent/JPS6437386A/en
Publication of JPS6437386A publication Critical patent/JPS6437386A/en
Pending legal-status Critical Current

Links

Landscapes

  • Packaging Frangible Articles (AREA)

Abstract

PURPOSE:To prevent the deformation or damage of each of lead terminals due to the mutual contact of the lead terminals during transport, by introducing semiconductors in a semiconductor receiving tube main body from one end thereof and interposing partitioning projections between the semiconductors while engaging a lid body with the tube main body. CONSTITUTION:A tube main body 3 has a left-and-right width as well as an up-and-down depth capable of receiving a large number of semiconductors 5,... each having lead terminals 5a,... provided to four sides thereof in a protruding state in one row. A large number of projections 8,... each having a predetermined before-and-behind width protruded in the tube main body 3 from a continuous opening 2 are arranged to the inner surface of a lid body 4 at a predetermined pitch. When the semiconductors 5... are received in the tube main body 3, the semiconductors 5 are successively charged in the tube main body and the lid body 4 deformed from the other end of the continuous opening 2 is successively pushed between guide projections 6, 6 to partition the semiconductors 5 by the projections 8. When the semiconductors 5,... are taken out, the lid body 4 is deformed from one end thereof to take out the semiconductors 5.
JP62189361A 1987-07-28 1987-07-28 Semiconductor receiving tube Pending JPS6437386A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62189361A JPS6437386A (en) 1987-07-28 1987-07-28 Semiconductor receiving tube

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62189361A JPS6437386A (en) 1987-07-28 1987-07-28 Semiconductor receiving tube

Publications (1)

Publication Number Publication Date
JPS6437386A true JPS6437386A (en) 1989-02-08

Family

ID=16240036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62189361A Pending JPS6437386A (en) 1987-07-28 1987-07-28 Semiconductor receiving tube

Country Status (1)

Country Link
JP (1) JPS6437386A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5145405A (en) * 1990-05-15 1992-09-08 Hirose Electric Co., Ltd. Chip connector structure
KR100820184B1 (en) * 2007-02-23 2008-04-08 주식회사부원비엠에스 Forming method for connecting part of concrete reinforcements

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5145405A (en) * 1990-05-15 1992-09-08 Hirose Electric Co., Ltd. Chip connector structure
KR100820184B1 (en) * 2007-02-23 2008-04-08 주식회사부원비엠에스 Forming method for connecting part of concrete reinforcements

Similar Documents

Publication Publication Date Title
GB2135816B (en) Multi-planar electrode plasma etching
ZA834325B (en) Polymers with hydrophobe bunches
DE3167670D1 (en) A self-aligned process for providing an improved high performance bipolar transistor
KR960016508B1 (en) High voltage semiconductor with integrated low voltage circuitary
GB8317126D0 (en) Manufacturing semiconductor devices
DE3479190D1 (en) Lead for implantation into the human or animal body, comprising a helix cable with at least one conductor
EP0320244A3 (en) Electrical contact bump and a package provided with the same
MX165900B (en) RECOMBINANT, LEAD-ACID BATTERY, WITH MULTIPLE CELLS, WITH VIBRATION RESISTANT INTERCELL CONNECTOR
IL74218A0 (en) Nickel-hydrogen bipolar battery
EP0282576A4 (en) Non-aqueous electrochemical cell.
DE3381528D1 (en) SEMICONDUCTOR STORAGE ARRANGEMENT WITH SEVERAL CHARGE STORAGE TYPE CELLS.
EP0274801A3 (en) Method of manufacturing a semiconductor device of the "semiconductor on insulator" type
PT77567A (en) Multicell electric storage batteries
DE3378239D1 (en) Method of manufacturing a semiconductor device having a self-aligned gate electrode
DE2965730D1 (en) Process for manufacturing an insulating structure in a semiconductor body
JPS56134776A (en) Semiconductor storage cell
GB2167897B (en) Semiconductor manufacturing methods
IT8019078A0 (en) PROCEDURE FOR MANUFACTURING A METALLIC OXIDE SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONTACTS.
EP0111181A3 (en) Semiconductor component with a contact hole
US4211001A (en) Contact loading apparatus
GB8709727D0 (en) Etching semiconductor body
GB2124626B (en) Pesticidal oximes
ZA833653B (en) Improved hydrogen evolution cathode
DE3361073D1 (en) Process for the decomposition of a complex of ortho-benzoyl-benzoic acid, hydrofluoric acid and boron trifluoride
USD263219S (en) Electrical contact pin