JPS6438425A - Epoxy resin molding material - Google Patents
Epoxy resin molding materialInfo
- Publication number
- JPS6438425A JPS6438425A JP19393187A JP19393187A JPS6438425A JP S6438425 A JPS6438425 A JP S6438425A JP 19393187 A JP19393187 A JP 19393187A JP 19393187 A JP19393187 A JP 19393187A JP S6438425 A JPS6438425 A JP S6438425A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- optionally
- length
- during molding
- crosslinking agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 3
- 229920000647 polyepoxide Polymers 0.000 title abstract 3
- 239000012778 molding material Substances 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 5
- 239000003431 cross linking reagent Substances 0.000 abstract 2
- 238000000465 moulding Methods 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000003086 colorant Substances 0.000 abstract 1
- 238000011109 contamination Methods 0.000 abstract 1
- 239000007822 coupling agent Substances 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 239000005350 fused silica glass Substances 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE:To obtain the title material which neither forms mold-flash during molding nor causes contamination with ionic impurities, flow of wire during molding, etc., by mixing an epoxy resin with a specified cylindrical silica and optionally a crosslinking agent, etc. CONSTITUTION:100pts.wt. curable epoxy resin (A) having at least two epoxy groups in the molecule is mixed with 50-500pts.wt. cylindrical silica (B) which may be fibrous or rodlike, has a length of 3-100mu and a length/diameter >=3 and is preferably fused silica and optionally a crosslinking agent, a cure accelerator, a curing agent, a mold release, a colorant, a coupling agent, a filler other than component B, etc. (C), and the obtained mixture is kneaded, ground and optionally granulated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19393187A JPS6438425A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19393187A JPS6438425A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6438425A true JPS6438425A (en) | 1989-02-08 |
Family
ID=16316124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19393187A Pending JPS6438425A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6438425A (en) |
-
1987
- 1987-08-03 JP JP19393187A patent/JPS6438425A/en active Pending
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