JPS6438426A - Epoxy resin molding material - Google Patents
Epoxy resin molding materialInfo
- Publication number
- JPS6438426A JPS6438426A JP19392887A JP19392887A JPS6438426A JP S6438426 A JPS6438426 A JP S6438426A JP 19392887 A JP19392887 A JP 19392887A JP 19392887 A JP19392887 A JP 19392887A JP S6438426 A JPS6438426 A JP S6438426A
- Authority
- JP
- Japan
- Prior art keywords
- pack
- epoxy resin
- mixture
- optionally
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 3
- 229920000647 polyepoxide Polymers 0.000 title abstract 3
- 239000012778 molding material Substances 0.000 title 1
- 239000000203 mixture Substances 0.000 abstract 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 2
- 239000007795 chemical reaction product Substances 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000003431 cross linking reagent Substances 0.000 abstract 2
- 229920001568 phenolic resin Polymers 0.000 abstract 2
- 239000005011 phenolic resin Substances 0.000 abstract 2
- -1 polysiloxanes Polymers 0.000 abstract 2
- 229920002379 silicone rubber Polymers 0.000 abstract 2
- 239000004945 silicone rubber Substances 0.000 abstract 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 239000003086 colorant Substances 0.000 abstract 1
- 239000007822 coupling agent Substances 0.000 abstract 1
- 238000005336 cracking Methods 0.000 abstract 1
- 238000004132 cross linking Methods 0.000 abstract 1
- 229920001971 elastomer Polymers 0.000 abstract 1
- 239000000806 elastomer Substances 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229910052698 phosphorus Inorganic materials 0.000 abstract 1
- 239000011574 phosphorus Substances 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 229910000077 silane Inorganic materials 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE:To obtain the title material excellent in cracking resistance, by mixing a mixture of an epoxy resin with a phenolic resin at least either of which has been reacted with a two-pack curable silicone rubber with, optionally, a crosslinking agent, a curing agent, etc. CONSTITUTION:A curable epoxy resin (a) having at least two epoxy groups in the molecule and/or a phenolic resin (b) are reacted by heating with a two- pack curable silicone rubber (c) comprising pack A comprising a functional group-terminated diorganosiloxane and pack B comprising an at least trifunctional silane for linking and crosslinking base polysiloxanes into a three- dimensional rubbery elastomer and a catalyst to obtain a reaction product. A mixture of components (a) with (b) at least either of which is said reaction product is optionally mixed with a cure accelerator based on a phosphorus compound and/or a tert. amine, a crosslinking agent, a curing agent, a mold release, a colorant, a coupling agent, a filler, etc. (d), and the obtained mixture is kneaded, ground and optionally granulated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19392887A JPS6438426A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19392887A JPS6438426A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6438426A true JPS6438426A (en) | 1989-02-08 |
Family
ID=16316075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19392887A Pending JPS6438426A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6438426A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0234625A (en) * | 1988-07-25 | 1990-02-05 | Toshiba Chem Corp | Sealing resin composition |
| JPH0362844A (en) * | 1989-02-27 | 1991-03-18 | Shin Etsu Chem Co Ltd | Epoxy resin composition for sealing semiconductor and semiconductor device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS627723A (en) * | 1985-07-03 | 1987-01-14 | Shin Etsu Chem Co Ltd | epoxy resin composition |
| JPS63241021A (en) * | 1987-03-27 | 1988-10-06 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing electronic component |
-
1987
- 1987-08-03 JP JP19392887A patent/JPS6438426A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS627723A (en) * | 1985-07-03 | 1987-01-14 | Shin Etsu Chem Co Ltd | epoxy resin composition |
| JPS63241021A (en) * | 1987-03-27 | 1988-10-06 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing electronic component |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0234625A (en) * | 1988-07-25 | 1990-02-05 | Toshiba Chem Corp | Sealing resin composition |
| JPH0362844A (en) * | 1989-02-27 | 1991-03-18 | Shin Etsu Chem Co Ltd | Epoxy resin composition for sealing semiconductor and semiconductor device |
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