JPS6438437A - Low-stress polyimide resin precursor - Google Patents
Low-stress polyimide resin precursorInfo
- Publication number
- JPS6438437A JPS6438437A JP19379487A JP19379487A JPS6438437A JP S6438437 A JPS6438437 A JP S6438437A JP 19379487 A JP19379487 A JP 19379487A JP 19379487 A JP19379487 A JP 19379487A JP S6438437 A JPS6438437 A JP S6438437A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- low
- polyimide resin
- resin precursor
- recurring units
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002243 precursor Substances 0.000 title abstract 3
- 229920001721 polyimide Polymers 0.000 title abstract 2
- 239000009719 polyimide resin Substances 0.000 title abstract 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 2
- -1 tetracarboxylic diester Chemical class 0.000 abstract 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract 1
- 150000004985 diamines Chemical class 0.000 abstract 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
PURPOSE:To obtain the title precursor excellent in processability, storage stability and solubility in an organic solvent, by incorporating two specified kinds of recurring units. CONSTITUTION:A tetracarboxylic diester obtained by reacting a tetracarboxylic acid dianhydride with an alcohol is condensed with a diamine of any one of formulas I-IV [wherein R2 is H or methyl, n and m are each 0-2, R3-4 are each H, methyl or ethyl, and X is -O-, -S-, -SO2-, -CH2-, -C(CH3)2-, -C(CF3)2- or formula V] to obtain a low-stress polyimide resin precursor containing 60-90mol.% recurring units of formula VI or VII (wherein R1 is a 1-20C organic group, and Ar is formula VIII or IX) and 40-10mol.% recurring units of formula X or XI.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19379487A JPS6438437A (en) | 1987-08-04 | 1987-08-04 | Low-stress polyimide resin precursor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19379487A JPS6438437A (en) | 1987-08-04 | 1987-08-04 | Low-stress polyimide resin precursor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6438437A true JPS6438437A (en) | 1989-02-08 |
Family
ID=16313892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19379487A Pending JPS6438437A (en) | 1987-08-04 | 1987-08-04 | Low-stress polyimide resin precursor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6438437A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017193500A (en) * | 2016-04-19 | 2017-10-26 | 信越化学工業株式会社 | Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film |
| WO2025013140A1 (en) * | 2023-07-07 | 2025-01-16 | 株式会社レゾナック | Polyimide-based resin precursor, photosensitive resin composition, method for producing resin film, and amic acid ester compound |
| WO2025013141A1 (en) * | 2023-07-07 | 2025-01-16 | 株式会社レゾナック | Polyimide resin precursor, resin composition, method for producing polyimide resin, and method for producing resin film |
-
1987
- 1987-08-04 JP JP19379487A patent/JPS6438437A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017193500A (en) * | 2016-04-19 | 2017-10-26 | 信越化学工業株式会社 | Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film |
| WO2025013140A1 (en) * | 2023-07-07 | 2025-01-16 | 株式会社レゾナック | Polyimide-based resin precursor, photosensitive resin composition, method for producing resin film, and amic acid ester compound |
| WO2025013141A1 (en) * | 2023-07-07 | 2025-01-16 | 株式会社レゾナック | Polyimide resin precursor, resin composition, method for producing polyimide resin, and method for producing resin film |
| WO2025013702A1 (en) * | 2023-07-07 | 2025-01-16 | 株式会社レゾナック | Polyimide-based resin precursor, resin composition, method for producing polyimide-based resin, and method for producing resin film |
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