JPS6438823U - - Google Patents
Info
- Publication number
- JPS6438823U JPS6438823U JP13386487U JP13386487U JPS6438823U JP S6438823 U JPS6438823 U JP S6438823U JP 13386487 U JP13386487 U JP 13386487U JP 13386487 U JP13386487 U JP 13386487U JP S6438823 U JPS6438823 U JP S6438823U
- Authority
- JP
- Japan
- Prior art keywords
- wave device
- acoustic wave
- package
- electrically grounded
- surface acoustic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 2
- 239000013013 elastic material Substances 0.000 claims 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図はこの考案の実施例である弾性表面波素
子の実装構造を示す断面図、第２図は他の実施例
に係る弾性表面波素子の実装構造を表す断面図、
第３図は従来の弾性表面波素子の実装構造を表す
断面図である。
１……弾性表面波素子、２ａ，２ｂ，７ａ，７
ｂ，７ｃ……パツケージ、３ａ……電気的に接地
された導体、５ａ……電気的に接地された導体膜
、８ａ……電気的に接地された導体膜、１００…
…弾性表面波装置、１０１……回路基板（基体）
。
FIG. 1 is a sectional view showing a mounting structure of a surface acoustic wave device according to an embodiment of this invention, and FIG. 2 is a sectional view showing a mounting structure of a surface acoustic wave device according to another embodiment.
FIG. 3 is a cross-sectional view showing the mounting structure of a conventional surface acoustic wave element. 1...Surface acoustic wave element, 2a, 2b, 7a, 7
b, 7c...Package, 3a...Electrically grounded conductor, 5a...Electrically grounded conductor film, 8a...Electrically grounded conductor film, 100...
...Surface acoustic wave device, 101...Circuit board (substrate)
.
Claims (1)
を基板上に実装してなる弾性表面波素子の実装構
造であつて、 弾性表面波素子の、表面波が伝搬する主面に対
向する裏面をパツケージ内の電気的に接地された
導体または導体膜上に固定するとともに、電気的
に接地された導体からなる、または電気的に接地
された導体膜を有する基体に前記弾性表面波素子
の主面を対向させて前記パツケージを基体上に実
装したことを特徴とする弾性表面波素子の実装構
造。[Claims for Utility Model Registration] A mounting structure for a surface acoustic wave device in which a package in which a surface acoustic wave device is housed is mounted on a substrate, the structure comprising: The back surface facing the surface is fixed onto an electrically grounded conductor or conductive film in the package, and the elastic material is attached to the base made of an electrically grounded conductor or having an electrically grounded conductive film. A mounting structure for a surface acoustic wave device, characterized in that the package is mounted on a base with the main surfaces of the surface wave device facing each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13386487U JPS6438823U (en) | 1987-09-01 | 1987-09-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13386487U JPS6438823U (en) | 1987-09-01 | 1987-09-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6438823U true JPS6438823U (en) | 1989-03-08 |
Family
ID=31392120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13386487U Pending JPS6438823U (en) | 1987-09-01 | 1987-09-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6438823U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60239113A (en) * | 1984-05-14 | 1985-11-28 | Maruyasu Kogyo Kk | Elastic surface wave filter device |
-
1987
- 1987-09-01 JP JP13386487U patent/JPS6438823U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60239113A (en) * | 1984-05-14 | 1985-11-28 | Maruyasu Kogyo Kk | Elastic surface wave filter device |