JPS6439042A - Semiconductor integrated circuit - Google Patents

Abstract

PURPOSE:To densify circuit elements and to suppress switching noise by providing the first and second power supply planes separately from the wiring layer of signal wiring and by supplying positive and negative voltage to each circuit element via through holes and by interposing an insulating film between the first and second power supply planes. CONSTITUTION:A diffusion pattern 30 a for forming a cell is formed on the surface of a substrate 30 and the first layer wiring layer 40 provided on the substrate 30 is classified into a section 40 a corresponding to the diffusion pattern 30a to form wiring within cell. Each wiring 42a of wiring layer 42 mainly extends toward the X direction to perform wiring between each cell formed at bulk and an insulating film 43 is provided between the wiring layers 40 and 42. Each wiring 45a of wiring layer 45 mainly extends toward the Y direction to perform wiring in the Y direciton. An insulating film 46 is provided between the wiring layers 42 and 45. The first power supply plane 51 of negative power supply is provided on the wiring layer 45 through an insulating film 50 and the second power supply plane 53 of positive power supply is provided through an insulating film 52. Thus, the power supply planes 51 and 53, feed power via through-holes for each cell. It enables circuit elements to be highly integrated and suppresses switching noise.