JPS643941B2 - - Google Patents
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- JPS643941B2 JPS643941B2 JP7105486A JP7105486A JPS643941B2 JP S643941 B2 JPS643941 B2 JP S643941B2 JP 7105486 A JP7105486 A JP 7105486A JP 7105486 A JP7105486 A JP 7105486A JP S643941 B2 JPS643941 B2 JP S643941B2
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- Prior art keywords
- temperature
- billet
- rolling
- diameter
- pure
- Prior art date
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Description
〔産業上の利用分野〕
この発明は、熱間圧延ままでα粒径が100μm
以下の細粒再結晶組織を有する直径100mm以上の
純Ti大径ビレツトの圧延方法に関する。
〔従来の技術〕
純Tiは鋼に比べ熱拡散率が小さく、この傾向
は特に低温域で大きくなり、室温では鋼の1/2の
値を有する。第5図には熱定数と変形抵抗値をも
とに加工時の発熱を考慮した熱伝導モデルを用
い、300mmφの純Tiブルームを850℃に加熱後1
パス当りの圧下率10%、パス間時間10秒で圧延
し、放冷した場合の各ビレツト直径における圧延
終了後から600℃までの平均冷却速度を示した。
ビレツト径の増加とともに軸心部の冷却速度が低
下し、特にビレツト径が100mm以上では0.7℃/s
以下と極めて低速度で冷却される。
そのため純Tiのこのような大径ビレツトの圧
延に際しては、圧延後の冷却過程において著しい
粒成長が生じ細粒が得られないという問題があ
る。一方、純Tiビレツトはユーザ側で最終的な
熱間鍛造や熱間押出しで加工、成形される場合が
多いが、その場合、加工、成形性の面からビレツ
トのα粒径が100μm以下というような細粒が要
求される場合が多い。
そのため、このような微細なα粒径の指定があ
る場合は、加熱と加工を繰り返す熱間鍛造による
対処がなされてきた。
〔発明が解決しようとする問題点〕
しかし、以上の熱間鍛造では細粒が得られるも
のの、熱間圧延による製造に比べ歩留や生産性が
劣つてしまう。一方、従来の熱間圧延法ではこの
ような圧延後の冷却過程における粒成長には全く
留意されておらず、ビレツト径にかかわらず一律
850℃以上の高温域あるいはβ域に加熱圧延され
ているため、圧延後の冷却速度の遅い大径ビレツ
ト軸心部では100μm以上の粗粒が形成されるの
が現状である。従つて直径100mm以上の大径ビレ
ツトにおいても熱間圧延ままで100μm以下の細
粒が得られる製造方法が望まれていた。
〔問題点を解決するための手段〕
本発明はこのような問題を解決するため、多パ
ス加工後の冷却過程における純Tiα粒の粒成長挙
動を検討し、直径100mm以上の純Tiビレツトにお
いて、100μm以下の細粒組織が得られる圧延方
法を見出した。
以下本発明につき、詳細に説明する。
一般に純Tiのビレツト圧延においては、歪速
度1〜20/s、1パス当り5〜15%の加工がパス
間時間2〜15秒間隔で繰り返される。加工後の冷
却速度は第5図に示したように、ビレツト径によ
り変化するとともにビレツト軸方向の位置により
変化する。本発明者等はこのような条件を間圧縮
試験によりシミユレートし、第1図に示すような
パターンの加工を加え、種々の条件下における純
Tiα粒の粒成長挙動を調べた。ここで第1図のパ
ターンとは、加熱温度で1パス圧下率10%、歪速
度2.5/s、パス間時間10秒で5パスの加工を加
え、加工後は各種冷却速度、即ち放冷のほか、加
工後の加速冷却も想定して0.1℃/sから1℃/
sまで変化させ冷却するというものである。又、
この実験では圧延前の条件による加熱時(変形
前)のα粒径の影響も同時に調べるため、変形前
のα粒径を80μmから1600μmまで大幅に変化さ
せた。尚、第1図に示すように加工を常に等温T
で与えたのは、このような大径ビレツトの軸心部
では加工による発熱と表面への熱伝導による温度
降下がバランスし結果的にほとんど温度降下が生
じないためである。
第2図は上記した実験のうち、0.12%のOを含
有する純Tiを用い、初期α粒径及び加熱温度を
変化させ加工後0.15℃/sで冷却した場合の再結
晶α粒径の変化を示す。同図から明らかなよう
に、同一変形条件(この場合、上記の加工条件)
では初期(変形前)α粒径が細粒なほど加工後に
微細な再結晶α粒が得られるが、この初期α粒径
の影響よりも加工温度(図中加熱温度で示され
る)の影響が支配的である。0.15℃/sの冷却速
度において初期α粒径にかかわらず加工後のα粒
径(図中平均α粒径で示される)を100μm以下
にするには825℃より低温に加熱することが必要
である。また同図に示された再結晶率からみて
675℃加熱では完全再結晶組織が得られないこと
がわかる。
更に第3図は、上記した加工条件及び手順によ
り、初期α粒径が1600μmの場合における加熱温
度(加工温度に等しい)及び加工後の冷却速度を
変化させた場合の再結晶α粒径の調査結果を示す
ものである。同一加熱変形条件(同一加熱温度)
では、冷却速度の低下に伴い、冷却中に粒成長が
生じ、再結晶α粒径は増加する。又、どの冷却速
度においても、再結晶α粒径の変化は高温域の加
熱温度ほど著しく、同一再結晶α粒径を得るには
冷却速度が遅いほど、換言すれば大径ビレツトほ
ど加熱圧延温度を低くする必要がある。第3図の
結果より再結晶α粒径が100μm以下にするには
加熱温度Tr1(℃)は冷却速度R(℃/s)の関数
として、α域において下式を満足する必要があ
る。
Tr1≦853+42.5logR ……
一方、700℃加熱では冷却速度が早い場合は冷
却中に再結晶が完了せず未再結晶組織となる。従
つて完全再結晶組織とするには仕上げ温度Tr2
(℃)は冷却速度R(℃/s)の関数としてα域に
おいて下式を満足しなければならない。
Tr2≧710+15logR ……
実際の圧延では表層部は圧延中に著しい温度降
下を生じるため、上記した加熱圧延温度Tr2は表
面仕上温度に相当する。従つて表層から軸心部ま
で100μm以下の再結晶粒径を得るには、軸心部
の粒成長を抑制するため一旦Tr1≦853+
42.3logRに加熱し、更に表層部まで再結晶させる
ため表面温度Tr2≧710+15logRで圧延を終了す
る必要がある。
前述のようにビレツト径と冷却速度とが反比例
の関係にあるという事実を基に、上記式の冷
却速度を放冷時のビレツト径に対応させるため更
に次のような実験を行なつた。
即ち、ビレツト径が50mmから200mmまでの範囲
の純Tiを850℃に加熱し、次に放冷した際の軸心
部及び表面下2mmの冷却速度を測定し、そのデー
タを第4図にまとめた。尚、軸心部においては粒
成長に大きな影響を及ぼす800℃から600℃の温度
域を、又、表層部については再結晶の臨界温度で
ある700℃から600℃の温度範囲を測定した。
その結果、ビレツトの軸心部及び表層部の冷却
速度はそれぞれ次式で示される。
中心部 logR=3.0−1.6logd ……
表層部 logR=1.12−0.93logd ……
d:ビレツト直径(mm)
従つて、上式を夫々前記式に代入すれ
ば、
Tr1≦853+42.5(3.0−1.6logd) ……
Tr2≧710+15(1.12−0.93logd) ……
となり、上式に示すTr1以下の温度に加熱した
後、上式のTr2以上の表面温度で圧延を終了す
ることにより、表層から中心部まで100μm以下
の微細なα粒径を有する純Tiビレツトの製造が
可能である。
以上はビレツトを圧延終了後放冷した場合の臨
界加熱温度Tr1及び臨界仕上げ温度Tr2をビレツ
ト直径の関数で示したものであるが、圧延後加速
冷却を行う場合はビレツト径に関係なく前述した
式で示される冷却速度の関数として臨界加熱
温度Tr1及び臨界仕上げ温度Tr2適用される。
尚、ここで純Tiと称しているのは、H≦0.015
%、O≦0.40%、N≦0.05%、Fe≦0.50%及びそ
の他の不可避的不純物を含有する商業用Ti
(Commercial Pure Ti)である。
〔実施例〕
次に本発明の実施例につき説明する。
下記第1表は、第2表の成分を有する供試材を
用い、ビレツト圧延を行なつた時の該ビレツト軸
心部及び表層部のα粒径と、上式式で算出さ
れたその時の臨界加熱温度Tr1及び同じく式
で算出された臨界仕上げ温度Tr2とを、各圧延条
件と共に示したものである。
[Industrial field of application] This invention has an α grain size of 100 μm as hot-rolled.
The present invention relates to a method for rolling a large-diameter pure Ti billet having a diameter of 100 mm or more and having the following fine-grain recrystallized structure. [Prior Art] Pure Ti has a lower thermal diffusivity than steel, and this tendency becomes particularly large in the low temperature range, with a value 1/2 that of steel at room temperature. Figure 5 shows a heat conduction model that takes into account heat generation during machining based on thermal constants and deformation resistance values.
The average cooling rate from the end of rolling to 600°C for each billet diameter when rolling was performed at a rolling reduction rate of 10% per pass and a time between passes of 10 seconds and left to cool is shown.
As the billet diameter increases, the cooling rate of the shaft center decreases, especially when the billet diameter is 100 mm or more, the cooling rate decreases to 0.7℃/s.
It cools down at an extremely low rate. Therefore, when rolling such a large-diameter billet of pure Ti, there is a problem in that significant grain growth occurs during the cooling process after rolling, making it impossible to obtain fine grains. On the other hand, pure Ti billets are often processed and formed by final hot forging or hot extrusion at the user's end, but in this case, the α grain size of the billet should be 100 μm or less from the viewpoint of processing and formability. Very fine grains are often required. Therefore, when such a fine α grain size is specified, hot forging, which involves repeated heating and processing, has been used. [Problems to be Solved by the Invention] However, although fine grains can be obtained by the hot forging described above, the yield and productivity are inferior to those produced by hot rolling. On the other hand, in the conventional hot rolling method, no consideration is given to grain growth during the cooling process after rolling, and the billet size is uniformly reduced regardless of the billet diameter.
Since the billets are hot-rolled in the high temperature range of 850°C or higher or in the β range, coarse grains of 100 μm or more are currently formed in the axial center of large-diameter billets where the cooling rate after rolling is slow. Therefore, there has been a desire for a manufacturing method that can produce fine grains of 100 μm or less even in large-diameter billets with a diameter of 100 mm or more, even after hot rolling. [Means for Solving the Problems] In order to solve these problems, the present invention investigated the grain growth behavior of pure Tiα grains during the cooling process after multi-pass processing, and in pure Ti billets with a diameter of 100 mm or more, We have discovered a rolling method that allows a fine grain structure of 100 μm or less to be obtained. The present invention will be explained in detail below. Generally, in billet rolling of pure Ti, processing is repeated at a strain rate of 1 to 20/s and a rate of 5 to 15% per pass at intervals of 2 to 15 seconds between passes. As shown in FIG. 5, the cooling rate after processing varies depending on the billet diameter and also varies depending on the position in the axial direction of the billet. The present inventors simulated these conditions by interstitial compression tests, added the pattern shown in Figure 1, and tested the purity under various conditions.
The grain growth behavior of Tiα grains was investigated. Here, the pattern shown in Figure 1 means that 5 passes are performed at a heating temperature with a reduction rate of 10%, a strain rate of 2.5/s, and an interpass time of 10 seconds, and after processing, various cooling rates are applied, that is, cooling In addition, assuming accelerated cooling after processing, the speed is 0.1℃/s to 1℃/s.
s and then cooled. or,
In this experiment, in order to simultaneously examine the influence of the pre-rolling conditions on the α grain size during heating (before deformation), the α grain size before deformation was significantly varied from 80 μm to 1600 μm. Furthermore, as shown in Fig. 1, the machining is always carried out at an isothermal T.
The reason for this is that in the axial center of such a large-diameter billet, the heat generated by machining and the temperature drop due to heat conduction to the surface are balanced, resulting in almost no temperature drop. Figure 2 shows the changes in the recrystallized α grain size in the above experiment, using pure Ti containing 0.12% O, changing the initial α grain size and heating temperature, and cooling at 0.15°C/s after processing. shows. As is clear from the figure, the same deformation conditions (in this case, the above processing conditions)
In this case, the finer the initial α grain size (before deformation), the finer the recrystallized α grains can be obtained after processing, but the influence of the processing temperature (indicated by the heating temperature in the figure) is more important than the influence of the initial α grain size. dominant. At a cooling rate of 0.15°C/s, heating to a temperature lower than 825°C is required to reduce the α grain size after processing (indicated by the average α grain size in the figure) to 100 μm or less regardless of the initial α grain size. be. Also, considering the recrystallization rate shown in the same figure,
It can be seen that a complete recrystallized structure cannot be obtained by heating at 675°C. Furthermore, Figure 3 shows an investigation of the recrystallized α grain size when the heating temperature (equal to the processing temperature) and cooling rate after processing were changed when the initial α grain size was 1600 μm under the processing conditions and procedures described above. This shows the results. Same heating deformation conditions (same heating temperature)
In this case, as the cooling rate decreases, grain growth occurs during cooling, and the recrystallized α grain size increases. In addition, at any cooling rate, the change in the recrystallized α grain size is more pronounced as the heating temperature reaches a higher temperature range, and the slower the cooling rate is to obtain the same recrystallized α grain size, in other words, the larger the billet is, the more the hot rolling temperature is required. needs to be lowered. From the results shown in FIG. 3, in order to make the recrystallized α grain size 100 μm or less, the heating temperature Tr 1 (°C) must satisfy the following equation in the α region as a function of the cooling rate R (°C/s). Tr 1 ≦853+42.5logR... On the other hand, when heating to 700°C, if the cooling rate is fast, recrystallization will not be completed during cooling, resulting in an unrecrystallized structure. Therefore, in order to obtain a complete recrystallized structure, the finishing temperature Tr 2
(°C) must satisfy the following formula in the α region as a function of the cooling rate R (°C/s). Tr 2 ≧710+15logR ... In actual rolling, the temperature of the surface layer portion significantly drops during rolling, so the hot rolling temperature Tr 2 described above corresponds to the surface finishing temperature. Therefore, in order to obtain a recrystallized grain size of 100 μm or less from the surface layer to the axial center, it is necessary to first set Tr 1 ≦853+ to suppress grain growth in the axial center.
In order to heat to 42.3 logR and further recrystallize up to the surface layer, it is necessary to finish rolling at a surface temperature Tr 2 ≧710+15 logR. Based on the fact that the billet diameter and the cooling rate are inversely proportional as mentioned above, the following experiment was further conducted in order to make the cooling rate in the above equation correspond to the billet diameter during cooling. That is, when pure Ti with a billet diameter ranging from 50 mm to 200 mm was heated to 850°C and then allowed to cool, the cooling rate at the axial center and 2 mm below the surface was measured, and the data is summarized in Figure 4. Ta. The temperature range of 800°C to 600°C, which has a large effect on grain growth, was measured in the axial center, and the temperature range of 700°C to 600°C, which is the critical temperature for recrystallization, was measured in the surface layer. As a result, the cooling rates of the axial center portion and surface layer portion of the billet are expressed by the following equations. Center part logR=3.0−1.6logd ... Surface layer logR=1.12−0.93logd ... d: Billet diameter (mm) Therefore, if the above formulas are substituted into the above formulas, Tr 1 ≦853 + 42.5 (3.0− Tr 2 ≧710+15 (1.12−0.93logd) …… By heating to a temperature below Tr 1 shown in the above formula and then finishing rolling at a surface temperature above Tr 2 in the above equation, It is possible to produce a pure Ti billet with a fine α grain size of 100 μm or less from the surface layer to the center. The above shows the critical heating temperature Tr 1 and critical finishing temperature Tr 2 as a function of the billet diameter when the billet is left to cool after rolling. However, when accelerated cooling is performed after rolling, the above-mentioned The critical heating temperature Tr 1 and the critical finishing temperature Tr 2 are applied as a function of the cooling rate given by the formula: In addition, what is called pure Ti here is H≦0.015.
%, O≦0.40%, N≦0.05%, Fe≦0.50% and other unavoidable impurities.
(Commercial Pure Ti). [Example] Next, an example of the present invention will be described. Table 1 below shows the α grain size of the billet axial center and surface layer when billet rolling is performed using a test material having the components shown in Table 2, and the α grain size at that time calculated using the above formula. The critical heating temperature Tr 1 and the critical finishing temperature Tr 2 calculated using the same formula are shown together with each rolling condition.
【表】
*…連続ミル圧延
[Table] *…Continuous mill rolling
以上説明したように、本発明法によれば、従来
困難であつた熱間圧延による純Ti大径ビレツト
のα粒細粒化が可能になり、そのため歩留、生産
性を向上せしめることができるという優れた効果
を有している。
As explained above, according to the method of the present invention, it is possible to refine the alpha grains of pure Ti large-diameter billets by hot rolling, which has been difficult in the past, and as a result, yield and productivity can be improved. It has this excellent effect.
第1図は各種実験を行なつた際の加工パターン
の説明図、第2図は加熱温度に伴平均α粒径及び
再結晶率の変化を初期の粒径別に示したグラフ
図、第3図は加熱温度及び冷却速度の変化に伴う
α粒径の変化を示すグラフ図、第4図はビレツト
放冷時の各ビレツト径における平均冷却速度を示
すグラフ図、第5図は各ビレツト直径における冷
却速度の変化を示すグラフ図である。
Figure 1 is an explanatory diagram of processing patterns used in various experiments, Figure 2 is a graph showing changes in average α grain size and recrystallization rate according to heating temperature, depending on initial grain size, and Figure 3 is a graph showing the change in α grain size due to changes in heating temperature and cooling rate, Fig. 4 is a graph showing the average cooling rate for each billet diameter when the billet is allowed to cool, and Fig. 5 is a graph showing the cooling rate for each billet diameter. It is a graph diagram showing changes in speed.
Claims (1)
際し、下式(1)に示される臨界加熱温度Tr1以下の
温度に加熱した後、同じく下式(2)に示される臨界
仕上げ温度Tr2以上の表面温度で圧延を終了し、
放冷することを特徴とする熱間圧延ままで細粒再
結晶組織を有する純Ti大径ビレツトの圧延方法。 Tr1=853+42.5(3.0−1.6logd) ……(1) Tr2=710+15(1.12−0.93logd) ……(2) Tr1、Tr2:単位℃ d:ビレツトの直径、単位mm 2 直径100mm以上の純Ti大径ビレツトの圧延に
際し、下式(3)に示される臨界加熱温度Tr1以下の
温度に加熱した後、同じく下式(4)に示される臨界
仕上げ温度Tr2以上の表面温度で圧延を終了し、
更に両式に示される冷却速度Rで加速冷却するこ
とを特徴とする熱間圧延ままで細粒再結晶組織を
有する純Ti大径ビレツトの圧延方法。 Tr1=853+42.5logR ……(3) Tr2=710+15logR ……(4) Tr1、Tr2:単位℃ R:単位℃/s[Claims] 1. When rolling a pure Ti large-diameter billet with a diameter of 100 mm or more, after heating it to a temperature below the critical heating temperature Tr 1 shown in the following formula (1), Finish rolling at a surface temperature above critical finishing temperature Tr 2 ,
A method for rolling a pure Ti large-diameter billet having a fine-grain recrystallized structure as hot-rolled, characterized by allowing it to cool. Tr 1 = 853 + 42.5 (3.0 - 1.6 logd) ... (1) Tr 2 = 710 + 15 (1.12 - 0.93 logd) ... (2) Tr 1 , Tr 2 : Unit: °C d: Diameter of billet, unit: mm 2 Diameter When rolling a large-diameter pure Ti billet of 100 mm or more, after heating it to a temperature below the critical heating temperature Tr 1 shown in equation (3) below, the surface reaches a critical finishing temperature Tr 2 or above, also shown in equation (4) below. Finish rolling at temperature,
A method for rolling a large-diameter pure Ti billet having a fine-grain recrystallized structure as hot-rolled, which further comprises performing accelerated cooling at a cooling rate R shown in both equations. Tr 1 = 853 + 42.5logR ... (3) Tr 2 = 710 + 15logR ... (4) Tr 1 , Tr 2 : Unit: °C R: Unit: °C/s
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7105486A JPS62228458A (en) | 1986-03-31 | 1986-03-31 | Method for rolling pure ti billet of large diameter having fine recrystallized structure as hot rolled |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7105486A JPS62228458A (en) | 1986-03-31 | 1986-03-31 | Method for rolling pure ti billet of large diameter having fine recrystallized structure as hot rolled |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62228458A JPS62228458A (en) | 1987-10-07 |
| JPS643941B2 true JPS643941B2 (en) | 1989-01-24 |
Family
ID=13449420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7105486A Granted JPS62228458A (en) | 1986-03-31 | 1986-03-31 | Method for rolling pure ti billet of large diameter having fine recrystallized structure as hot rolled |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62228458A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0218610U (en) * | 1988-07-20 | 1990-02-07 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109127726B (en) * | 2018-08-22 | 2020-06-19 | 佛山职业技术学院 | Preparation method of industrial pure titanium plate |
-
1986
- 1986-03-31 JP JP7105486A patent/JPS62228458A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0218610U (en) * | 1988-07-20 | 1990-02-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62228458A (en) | 1987-10-07 |
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