JPS6439565A - Test board for semiconductor device - Google Patents

Test board for semiconductor device

Info

Publication number
JPS6439565A
JPS6439565A JP62196777A JP19677787A JPS6439565A JP S6439565 A JPS6439565 A JP S6439565A JP 62196777 A JP62196777 A JP 62196777A JP 19677787 A JP19677787 A JP 19677787A JP S6439565 A JPS6439565 A JP S6439565A
Authority
JP
Japan
Prior art keywords
connection part
analog signal
electrode
ground
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62196777A
Other languages
Japanese (ja)
Other versions
JPH0820488B2 (en
Inventor
Kazuaki Masuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC IC Microcomputer Systems Co Ltd
Original Assignee
NEC IC Microcomputer Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC IC Microcomputer Systems Co Ltd filed Critical NEC IC Microcomputer Systems Co Ltd
Priority to JP62196777A priority Critical patent/JPH0820488B2/en
Publication of JPS6439565A publication Critical patent/JPS6439565A/en
Publication of JPH0820488B2 publication Critical patent/JPH0820488B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Connecting Device With Holders (AREA)

Abstract

PURPOSE:To reduce variance in measurement and to perform accurate measurement by providing the ground potential electrode of an analog signal system and an external connection part on one surface and also providing the ground potential electrode of a digital signal system and an external connection part on the other surface. CONSTITUTION:The connection part 3a for an external measuring instrument, the ground potential electrode 2a of the analog signal system, and a socket 4 for a semiconductor device are formed on the surface of a flat plate type substrate 1 from the outside. The electrode 2a, a ground terminal 5, and a connection part 8 for an external ground terminal are connected and an analog signal terminal 6 and the corresponding connection part 3a are connected by an analog signal line. Further, the connection part 3b for an external measuring instrument and the ground electrode 2b of the digital signal system are formed on the reverse surface of the substrate 1 from the outside. The electrode 2b, and the ground terminal 5 and connection part 8 are connected and a digital signal terminal 7 and the corresponding connection part 3b are connected. Consequently, the analog signal line and digital signal line never cross each other and the electrodes 2a and 2b are shielded at the ground potential by the surfaces, so an analog signal and noises are prevented from being applied to the analog signal line.
JP62196777A 1987-08-05 1987-08-05 Test board for semiconductor device Expired - Fee Related JPH0820488B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62196777A JPH0820488B2 (en) 1987-08-05 1987-08-05 Test board for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62196777A JPH0820488B2 (en) 1987-08-05 1987-08-05 Test board for semiconductor device

Publications (2)

Publication Number Publication Date
JPS6439565A true JPS6439565A (en) 1989-02-09
JPH0820488B2 JPH0820488B2 (en) 1996-03-04

Family

ID=16363459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62196777A Expired - Fee Related JPH0820488B2 (en) 1987-08-05 1987-08-05 Test board for semiconductor device

Country Status (1)

Country Link
JP (1) JPH0820488B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217422A (en) * 2001-01-18 2002-08-02 Fuji Electric Co Ltd Semiconductor physical quantity sensor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217422A (en) * 2001-01-18 2002-08-02 Fuji Electric Co Ltd Semiconductor physical quantity sensor
GB2374676A (en) * 2001-01-18 2002-10-23 Fuji Electric Co Ltd Semiconductor Physical Quality Sensor
GB2374676B (en) * 2001-01-18 2005-03-02 Fuji Electric Co Ltd Semiconductor physical quality sensor
US6962081B2 (en) 2001-01-18 2005-11-08 Fuji Electric Co., Ltd. Semiconductor physical quantity sensor with improved noise resistance

Also Published As

Publication number Publication date
JPH0820488B2 (en) 1996-03-04

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees