JPS6440202U - - Google Patents
Info
- Publication number
- JPS6440202U JPS6440202U JP13578687U JP13578687U JPS6440202U JP S6440202 U JPS6440202 U JP S6440202U JP 13578687 U JP13578687 U JP 13578687U JP 13578687 U JP13578687 U JP 13578687U JP S6440202 U JPS6440202 U JP S6440202U
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- power distribution
- distribution board
- electric circuit
- circuit section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Patch Boards (AREA)
Description
第１図は本考案の実施例の外観斜視図、第２図
ａ，ｂは第１図に示した実施例の平面図と正面図
を示し、第３図は本実施例の配電盤に収容される
電気回路の接続図である。
１……配電盤、２……函体、６……第１室（周
囲上限温度が低温の部材を収容した室）、７……
第２室（周囲上限温度が高温の部材を収容した室
）、８……第３室（非密閉室）、９，１０……熱
しやへい板、１１……ヒートシンク。
Fig. 1 is an external perspective view of an embodiment of the present invention, Figs. 2a and 2b are a plan view and a front view of the embodiment shown in Fig. 1, and Fig. 3 is a perspective view of the embodiment of the invention. FIG. 2 is a connection diagram of an electric circuit. 1... Switchboard, 2... Box, 6... First chamber (chamber containing components with low ambient upper limit temperature), 7...
2nd chamber (chamber containing a member with a high ambient upper limit temperature), 8... 3rd chamber (non-sealed room), 9, 10... heat shielding plate, 11... heat sink.
Claims (1)
した部材が発生する熱をヒートシンクを介して配
電盤の外部へ放熱する配電盤の熱しやへい機構に
おいて、 前記配電盤の内部を少なくとも３室以上に分割
して各室の間に熱しやへい板を配設して夫々を区
分けすると共に、第１の室には周囲上限温度が低
温の部材から成る電気回路部を収容し、第２の室
には周囲上限温度が高温の部材から成る電気回路
部を収容し、第３の室は非密閉室に形成して外部
雰囲気のもとで使用する部材から成る電気回路部
を収容したことを特徴とする配電盤の熱しやへい
機構。[Scope of Claim for Utility Model Registration] A heat shielding mechanism for a power distribution board in which the power distribution board has a sealed structure and heat generated by members disposed inside the power distribution board is radiated to the outside of the power distribution board via a heat sink, Divided into at least three or more chambers, each chamber is partitioned by placing a heat shield plate between each chamber, and the first chamber accommodates an electric circuit section made of a member with a low ambient upper limit temperature, The second chamber accommodates an electric circuit section made of members having a high ambient upper limit temperature, and the third chamber is formed as a non-sealed chamber and accommodates an electric circuit section made of members used in an external atmosphere. A heat shielding mechanism for a power distribution board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13578687U JPS6440202U (en) | 1987-09-04 | 1987-09-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13578687U JPS6440202U (en) | 1987-09-04 | 1987-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6440202U true JPS6440202U (en) | 1989-03-10 |
Family
ID=31395695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13578687U Pending JPS6440202U (en) | 1987-09-04 | 1987-09-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6440202U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010226858A (en) * | 2009-03-23 | 2010-10-07 | Toshiba Mitsubishi-Electric Industrial System Corp | Control panel device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5818394B2 (en) * | 1973-03-20 | 1983-04-12 | 三菱電線工業株式会社 | How to use the hand |
-
1987
- 1987-09-04 JP JP13578687U patent/JPS6440202U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5818394B2 (en) * | 1973-03-20 | 1983-04-12 | 三菱電線工業株式会社 | How to use the hand |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010226858A (en) * | 2009-03-23 | 2010-10-07 | Toshiba Mitsubishi-Electric Industrial System Corp | Control panel device |
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