JPS6440515A - Epoxy polymer composition for sealing semiconductor - Google Patents
Epoxy polymer composition for sealing semiconductorInfo
- Publication number
- JPS6440515A JPS6440515A JP19866487A JP19866487A JPS6440515A JP S6440515 A JPS6440515 A JP S6440515A JP 19866487 A JP19866487 A JP 19866487A JP 19866487 A JP19866487 A JP 19866487A JP S6440515 A JPS6440515 A JP S6440515A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- polymer composition
- type
- epoxy polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004593 Epoxy Substances 0.000 title 1
- 229920000642 polymer Polymers 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000003822 epoxy resin Substances 0.000 abstract 7
- 229920000647 polyepoxide Polymers 0.000 abstract 7
- 229920003986 novolac Polymers 0.000 abstract 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 229930003836 cresol Natural products 0.000 abstract 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000011256 inorganic filler Substances 0.000 abstract 2
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 abstract 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE:To obtain the titled composition having excellent fluidity, water-vapor resistance and thermal shock resistance, containing an epoxy resin of epi-bis type, an epoxy resin of cresol novolak type, a curing agent of phenolic novolak resin, a curing promoter and an inorganic filler. CONSTITUTION:The aimed composition containing (A) 30-95wt.% based on total epoxy resins of an epoxy resin (epoxy resin derived from bisphenol A and epichlorohydrin) of epi-bis type, (B) 5-70wt.% based on total epoxy resins of an epoxy resin of cresol novolak type, (C) a curing agent of phenolic novolak resin, (D) a curing promoter (e.g. 2-ethyl-4-methylimidazole) and (E) an inorganic filler (e.g. silica or alumina).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19866487A JPS6440515A (en) | 1987-08-07 | 1987-08-07 | Epoxy polymer composition for sealing semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19866487A JPS6440515A (en) | 1987-08-07 | 1987-08-07 | Epoxy polymer composition for sealing semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6440515A true JPS6440515A (en) | 1989-02-10 |
Family
ID=16394990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19866487A Pending JPS6440515A (en) | 1987-08-07 | 1987-08-07 | Epoxy polymer composition for sealing semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6440515A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7993128B2 (en) | 2007-02-09 | 2011-08-09 | Sumitomo Heavy Industries, Ltd. | Screw and injection apparatus |
| JPWO2023127800A1 (en) * | 2021-12-28 | 2023-07-06 |
-
1987
- 1987-08-07 JP JP19866487A patent/JPS6440515A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7993128B2 (en) | 2007-02-09 | 2011-08-09 | Sumitomo Heavy Industries, Ltd. | Screw and injection apparatus |
| JPWO2023127800A1 (en) * | 2021-12-28 | 2023-07-06 | ||
| WO2023127800A1 (en) * | 2021-12-28 | 2023-07-06 | 旭化成株式会社 | Epoxy resin composition, cured product, sealing material, and adhesive |
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