JPS6442231A - Metal foil clad epoxy resin film - Google Patents
Metal foil clad epoxy resin filmInfo
- Publication number
- JPS6442231A JPS6442231A JP19827187A JP19827187A JPS6442231A JP S6442231 A JPS6442231 A JP S6442231A JP 19827187 A JP19827187 A JP 19827187A JP 19827187 A JP19827187 A JP 19827187A JP S6442231 A JPS6442231 A JP S6442231A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- metal foil
- compounds
- polythiol compound
- resin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 5
- 229910052751 metal Inorganic materials 0.000 title abstract 5
- 239000002184 metal Substances 0.000 title abstract 5
- 229920000647 polyepoxide Polymers 0.000 title abstract 5
- 239000011888 foil Substances 0.000 title abstract 4
- 150000001875 compounds Chemical class 0.000 abstract 4
- 229920006295 polythiol Polymers 0.000 abstract 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 150000001412 amines Chemical class 0.000 abstract 2
- 239000003054 catalyst Substances 0.000 abstract 2
- -1 e.g. Substances 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 2
- 229910000851 Alloy steel Inorganic materials 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- 150000001334 alicyclic compounds Chemical class 0.000 abstract 1
- 150000007824 aliphatic compounds Chemical class 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 150000002460 imidazoles Chemical class 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229920000768 polyamine Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract 1
- 239000011135 tin Substances 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
- 239000011701 zinc Substances 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE:To obtain excellent hygroscopicity, heat resistance and folding endurance, by constituting a metal foil and a flexible epoxy resin layer and containing a hardener and a polythiol compound in said resin layer. CONSTITUTION:As metals for a metal foil, e.g., copper, aluminum, nickel, tin, zinc, their alloys and stainless steel are used. A flexible epoxy resin composition is a base for a metal foil clad epoxy resin film and constituted of an epoxy resin main component, a polythiol compound hardener and an amine curing catalyst. The polythiol compound especially contributes to the film flexibility. The polythiol compounds are aliphatic and alicyclic compounds having two or more, preferably 3-4 SH groups. As the amine curing catalysts, polyamines, tertiary amine compounds and imidazole compounds alone or the mixtures of two or more kinds thereof are used.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19827187A JPS6442231A (en) | 1987-08-10 | 1987-08-10 | Metal foil clad epoxy resin film |
| US07/230,310 US4882216A (en) | 1987-08-10 | 1988-08-09 | Epoxy resin film covered with metal foil and flexible printed wiring board |
| EP19880112913 EP0303225A3 (en) | 1987-08-10 | 1988-08-09 | Epoxy resin film covered with metal foil and flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19827187A JPS6442231A (en) | 1987-08-10 | 1987-08-10 | Metal foil clad epoxy resin film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6442231A true JPS6442231A (en) | 1989-02-14 |
Family
ID=16388357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19827187A Pending JPS6442231A (en) | 1987-08-10 | 1987-08-10 | Metal foil clad epoxy resin film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6442231A (en) |
-
1987
- 1987-08-10 JP JP19827187A patent/JPS6442231A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3641195A (en) | Curable compositions containing an epoxide resin and a copolymer o an olefine hydrocarbon with an olefine ester | |
| ES546944A0 (en) | CHEMICALLY HARDENING RESINS CONSTITUTED BY COMPOUNDS CONTAINING GROUPS 1-0XA-3-AZA-TETRALINE AND CYCLOALIFATIC E-POXIDE RESINS, PROCEDURE FOR THEIR OBTAINING AND IN-HARDENING AS WELL AS THE USE OF SUCH RESINS | |
| MY101959A (en) | Solventless, polyimide- modified epoxy composition | |
| GB1039021A (en) | Epoxy resin compositions | |
| GB1424269A (en) | Adhesive composition for flexible printed circuit and method for using the same | |
| ATE122069T1 (en) | WATER-DILUTIBLE HARDENERS FOR EPOXY RESINS. | |
| CA2082215A1 (en) | Room-temperature curable epoxy resin composition | |
| KR860001146A (en) | Epoxy Resin Composition with Fast Curing Time | |
| ES8801330A1 (en) | Polyepoxydes and their use. | |
| ES450476A1 (en) | Adhesive, gluing, putty, sealer and coating materials from (1) hardenable component, (2) metal salt and (3) pulverulent olefin polymer | |
| GB1497725A (en) | Adhesive for metal-clad sheeting | |
| ATE24925T1 (en) | CURING AGENT FOR EPOXY RESINS AND METHOD OF CURING EPOXY RESINS. | |
| ES8406530A1 (en) | Two-component coating compositions for rusty steels. | |
| JPS6442231A (en) | Metal foil clad epoxy resin film | |
| ES427131A1 (en) | Cured epoxy polymer | |
| KR900001783A (en) | Low Viscosity Epoxy Resin Compositions | |
| KR830006081A (en) | Tin-coated welding cans with seam | |
| KR910020144A (en) | Method of bonding polyimide film and printed circuit board | |
| GB8432606D0 (en) | Heat curable epoxide resin compositions | |
| JPS5790072A (en) | Resist ink composition for chemical plating | |
| JPS5278934A (en) | Adhesive composition for chemical plating | |
| JPH05112765A (en) | Curable adhesive composition | |
| JPS57212226A (en) | Resin composition | |
| IE850184L (en) | Circuit boards made of laminates | |
| JPS57159866A (en) | Laminating adhesive between polyolefin and metal |