JPS6442247A - Assembly of orifice board - Google Patents

Assembly of orifice board

Info

Publication number
JPS6442247A
JPS6442247A JP62198526A JP19852687A JPS6442247A JP S6442247 A JPS6442247 A JP S6442247A JP 62198526 A JP62198526 A JP 62198526A JP 19852687 A JP19852687 A JP 19852687A JP S6442247 A JPS6442247 A JP S6442247A
Authority
JP
Japan
Prior art keywords
adhesive
orifice board
orifice
board
adhered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62198526A
Other languages
Japanese (ja)
Other versions
JPH0729422B2 (en
Inventor
Kenji Akami
Hajime Oda
Masayoshi Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP19852687A priority Critical patent/JPH0729422B2/en
Publication of JPS6442247A publication Critical patent/JPS6442247A/en
Publication of JPH0729422B2 publication Critical patent/JPH0729422B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1623Manufacturing processes bonding and adhesion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01Embodiments of or processes related to ink-jet heads
    • B41J2202/02Air-assisted ejection

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

PURPOSE:To enable an orifice board to be precisely flatly adhered, by adhering an orifice board liable to be warped to a component to be adhered in a state where it is temporarily kept flat with pressure jig as it is. CONSTITUTION:A temporary adhesive 28 is spread on a pressing surface 27 of which a temperature is elevated to 60 deg.C. Then, an edge surface 21 side of a first orifice board 7 is opposed to the pressing surface 27, its temperature is lowered pressing the whole body, and the orifice board 7 is flatly temporarily kept by the temporary adhesive 28 with the pressing surface 27. Then, an adhesive 14 is spread on a body member 16, the orifice board 7 is placed on the adhesive 14 with the orifice board 7 temporarily bonded to a pressure jig 26, and the adhesive 14 is hardened at room temperature where the temporary adhesive 28 is not softened. After adhering the orifice board 7 to the body member 16 and a control electrode 15 of members to be adhered by the adhesive 14, the temporary adhesive 28 is dissolved by ultrasonic cleaning with solvent of tricholroethylene, and the pressure jig 26 is removed. Assembly can be thereby performed with good accuracy.
JP19852687A 1987-08-07 1987-08-07 Orifice plate assembly method Expired - Lifetime JPH0729422B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19852687A JPH0729422B2 (en) 1987-08-07 1987-08-07 Orifice plate assembly method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19852687A JPH0729422B2 (en) 1987-08-07 1987-08-07 Orifice plate assembly method

Publications (2)

Publication Number Publication Date
JPS6442247A true JPS6442247A (en) 1989-02-14
JPH0729422B2 JPH0729422B2 (en) 1995-04-05

Family

ID=16392608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19852687A Expired - Lifetime JPH0729422B2 (en) 1987-08-07 1987-08-07 Orifice plate assembly method

Country Status (1)

Country Link
JP (1) JPH0729422B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05221015A (en) * 1992-02-14 1993-08-31 Kyocera Corp Image device
JP2001096802A (en) * 1999-10-04 2001-04-10 Canon Inc Method of manufacturing LED array head

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05221015A (en) * 1992-02-14 1993-08-31 Kyocera Corp Image device
JP2001096802A (en) * 1999-10-04 2001-04-10 Canon Inc Method of manufacturing LED array head

Also Published As

Publication number Publication date
JPH0729422B2 (en) 1995-04-05

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