JPS644277A - Application method of putty-state epoxy resin composition - Google Patents

Application method of putty-state epoxy resin composition

Info

Publication number
JPS644277A
JPS644277A JP22498587A JP22498587A JPS644277A JP S644277 A JPS644277 A JP S644277A JP 22498587 A JP22498587 A JP 22498587A JP 22498587 A JP22498587 A JP 22498587A JP S644277 A JPS644277 A JP S644277A
Authority
JP
Japan
Prior art keywords
epoxy resin
putty
resin composition
state epoxy
piping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22498587A
Other languages
Japanese (ja)
Inventor
Norio Kawamoto
Masahito Shimizu
Kazufumi Hamabuchi
Akira Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP22498587A priority Critical patent/JPS644277A/en
Publication of JPS644277A publication Critical patent/JPS644277A/en
Pending legal-status Critical Current

Links

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Paints Or Removers (AREA)

Abstract

PURPOSE:To enable application speed acceleration by applying a putty-state epoxy resin composition of specific viscosity to a material to be coated. CONSTITUTION:A putty-state epoxy resin composition 4 (consisting of epoxy resin, curing agent, additive, etc.) is mixed in a mixing tank 1 and adjusted so that the viscosity at application temperature may be 10<3>-5X10<4> poise. Next, the composition 4 is supplied to the neighborhood of a material to be coated 8 through flexible piping 5, and applied with the tip of the piping 5. Furthermore, it is possible to improve working efficiency by providing dies 6 made of material having a bending modulus of 10-500kg/mm<2> on the tip of the piping 5.
JP22498587A 1987-02-04 1987-09-08 Application method of putty-state epoxy resin composition Pending JPS644277A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22498587A JPS644277A (en) 1987-02-04 1987-09-08 Application method of putty-state epoxy resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2516787 1987-02-04
JP22498587A JPS644277A (en) 1987-02-04 1987-09-08 Application method of putty-state epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS644277A true JPS644277A (en) 1989-01-09

Family

ID=26362761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22498587A Pending JPS644277A (en) 1987-02-04 1987-09-08 Application method of putty-state epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS644277A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100407470C (en) * 2001-12-27 2008-07-30 株式会社东芝 Magnetic switching element and magnetic memory

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100407470C (en) * 2001-12-27 2008-07-30 株式会社东芝 Magnetic switching element and magnetic memory

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