JPS644444A - Copper wire for sound and its production - Google Patents
Copper wire for sound and its productionInfo
- Publication number
- JPS644444A JPS644444A JP62157565A JP15756587A JPS644444A JP S644444 A JPS644444 A JP S644444A JP 62157565 A JP62157565 A JP 62157565A JP 15756587 A JP15756587 A JP 15756587A JP S644444 A JPS644444 A JP S644444A
- Authority
- JP
- Japan
- Prior art keywords
- pure copper
- wire
- rod
- copper
- copper wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Electrolytic Production Of Metals (AREA)
- Conductive Materials (AREA)
- Continuous Casting (AREA)
Abstract
PURPOSE:To produce the titled wire suitable as the wire for an audio by prepg. the high pure copper wire contg. specific amounts of silver and sulfur and converted into single crystal. CONSTITUTION:A graphite mold 6 is attached on the bottom side face of a melting furnace 2 and a pure copper rod 3 is positioned into the pore of said mold 6 in such a manner that one end of the rod comes into the inner side from the charging side of molten metal 1 as about 1cm. The molten high pure copper in which the contents of copper and sulfur are each regulated to <=0.5ppm is then charged into the melting furnace 2 and the temp. in the furnace is risen to about 1,250 deg.C and retained. Water is furthermore passed into a cooling structural body 5 installed against the charging side of the molten metal and the rod of the solidified pure copper is applied to pulse drawing by the pure copper rod 3 to form the copper wire converted into the single crystal. In this way, the copper wire for sound by which an audio system having drastically good high-pitched tone can be obtd. is produced.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62157565A JPS644444A (en) | 1987-06-26 | 1987-06-26 | Copper wire for sound and its production |
| US07/080,336 US4792369A (en) | 1987-02-19 | 1987-07-30 | Copper wires used for transmitting sounds or images |
| US07/237,492 US4874436A (en) | 1987-02-19 | 1988-08-26 | Method for producing high purity electrolytic copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62157565A JPS644444A (en) | 1987-06-26 | 1987-06-26 | Copper wire for sound and its production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS644444A true JPS644444A (en) | 1989-01-09 |
| JPH042656B2 JPH042656B2 (en) | 1992-01-20 |
Family
ID=15652461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62157565A Granted JPS644444A (en) | 1987-02-19 | 1987-06-26 | Copper wire for sound and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS644444A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005307343A (en) * | 2004-03-23 | 2005-11-04 | Mitsubishi Materials Corp | High purity electrolytic copper and its manufacturing method |
| KR100749833B1 (en) * | 2004-09-21 | 2007-08-16 | 부산대학교 산학협력단 | single crystal wire and their manufacturing method |
| CN104190891A (en) * | 2014-09-10 | 2014-12-10 | 西安工业大学 | Device for manufacturing small-diameter metal single-crystal wire |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5529083U (en) * | 1978-08-17 | 1980-02-25 | ||
| JPS58103941A (en) * | 1981-12-16 | 1983-06-21 | Atsumi Ono | Production of metallic material having specular surface |
| JPS59167904A (en) * | 1983-03-11 | 1984-09-21 | 日立電線株式会社 | Wire for audio device |
| JPS61176454A (en) * | 1985-01-31 | 1986-08-08 | Nippon Mining Co Ltd | Continuous casting device |
| JPS61224443A (en) * | 1985-03-29 | 1986-10-06 | Mitsubishi Metal Corp | Bonding wire for semiconductor device |
| JPS6270589A (en) * | 1985-09-25 | 1987-04-01 | Nippon Mining Co Ltd | Manufacture of high purity electrolytic copper |
| JPS6289853A (en) * | 1985-10-16 | 1987-04-24 | Tanaka Denshi Kogyo Kk | Manufacture of copper wire for bonding semiconductor device |
| JPS6294969A (en) * | 1985-10-22 | 1987-05-01 | Mitsubishi Metal Corp | Bonding wire for semiconductor device |
| JPS62111455A (en) * | 1985-11-08 | 1987-05-22 | Mitsubishi Metal Corp | Very thin high-purity copper wire for wire-bonding semiconductor device |
-
1987
- 1987-06-26 JP JP62157565A patent/JPS644444A/en active Granted
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5529083U (en) * | 1978-08-17 | 1980-02-25 | ||
| JPS58103941A (en) * | 1981-12-16 | 1983-06-21 | Atsumi Ono | Production of metallic material having specular surface |
| JPS59167904A (en) * | 1983-03-11 | 1984-09-21 | 日立電線株式会社 | Wire for audio device |
| JPS61176454A (en) * | 1985-01-31 | 1986-08-08 | Nippon Mining Co Ltd | Continuous casting device |
| JPS61224443A (en) * | 1985-03-29 | 1986-10-06 | Mitsubishi Metal Corp | Bonding wire for semiconductor device |
| JPS6270589A (en) * | 1985-09-25 | 1987-04-01 | Nippon Mining Co Ltd | Manufacture of high purity electrolytic copper |
| JPS6289853A (en) * | 1985-10-16 | 1987-04-24 | Tanaka Denshi Kogyo Kk | Manufacture of copper wire for bonding semiconductor device |
| JPS6294969A (en) * | 1985-10-22 | 1987-05-01 | Mitsubishi Metal Corp | Bonding wire for semiconductor device |
| JPS62111455A (en) * | 1985-11-08 | 1987-05-22 | Mitsubishi Metal Corp | Very thin high-purity copper wire for wire-bonding semiconductor device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005307343A (en) * | 2004-03-23 | 2005-11-04 | Mitsubishi Materials Corp | High purity electrolytic copper and its manufacturing method |
| KR100749833B1 (en) * | 2004-09-21 | 2007-08-16 | 부산대학교 산학협력단 | single crystal wire and their manufacturing method |
| CN104190891A (en) * | 2014-09-10 | 2014-12-10 | 西安工业大学 | Device for manufacturing small-diameter metal single-crystal wire |
| CN104190891B (en) * | 2014-09-10 | 2016-04-06 | 西安工业大学 | Prepare the device of minor diameter metal single crystal wire rod |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH042656B2 (en) | 1992-01-20 |
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