JPS6444633U - - Google Patents

Info

Publication number
JPS6444633U
JPS6444633U JP1987137518U JP13751887U JPS6444633U JP S6444633 U JPS6444633 U JP S6444633U JP 1987137518 U JP1987137518 U JP 1987137518U JP 13751887 U JP13751887 U JP 13751887U JP S6444633 U JPS6444633 U JP S6444633U
Authority
JP
Japan
Prior art keywords
pellet
pad
bonding
bonding pads
pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987137518U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987137518U priority Critical patent/JPS6444633U/ja
Publication of JPS6444633U publication Critical patent/JPS6444633U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays

Landscapes

  • Wire Bonding (AREA)
JP1987137518U 1987-09-10 1987-09-10 Pending JPS6444633U (mo)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987137518U JPS6444633U (mo) 1987-09-10 1987-09-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987137518U JPS6444633U (mo) 1987-09-10 1987-09-10

Publications (1)

Publication Number Publication Date
JPS6444633U true JPS6444633U (mo) 1989-03-16

Family

ID=31399013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987137518U Pending JPS6444633U (mo) 1987-09-10 1987-09-10

Country Status (1)

Country Link
JP (1) JPS6444633U (mo)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55117251A (en) * 1979-02-28 1980-09-09 Fujitsu Ltd Semiconductor device
JPS6035524A (ja) * 1983-08-08 1985-02-23 Hitachi Micro Comput Eng Ltd 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55117251A (en) * 1979-02-28 1980-09-09 Fujitsu Ltd Semiconductor device
JPS6035524A (ja) * 1983-08-08 1985-02-23 Hitachi Micro Comput Eng Ltd 半導体装置

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