JPS6445196A - Flexible double-sided wiring board and manufacture thereof - Google Patents

Flexible double-sided wiring board and manufacture thereof

Info

Publication number
JPS6445196A
JPS6445196A JP20249587A JP20249587A JPS6445196A JP S6445196 A JPS6445196 A JP S6445196A JP 20249587 A JP20249587 A JP 20249587A JP 20249587 A JP20249587 A JP 20249587A JP S6445196 A JPS6445196 A JP S6445196A
Authority
JP
Japan
Prior art keywords
bonding agent
flexing
flexing part
wiring board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20249587A
Other languages
Japanese (ja)
Other versions
JPH07120851B2 (en
Inventor
Yutaka Hibino
Toshihide Kimura
Ken Okazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP62202495A priority Critical patent/JPH07120851B2/en
Publication of JPS6445196A publication Critical patent/JPS6445196A/en
Publication of JPH07120851B2 publication Critical patent/JPH07120851B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To prevent the cracking of the throughhole plating and the breaking- off of the bonding agent by forming a throughhole plating layer on a copper foil so as to extending in the direction of the flexing part with a gentle slope, and covering on the circuit corresponding to the flexing part and form the rear end of the flexing part to the non-flexing part with an insulating film. CONSTITUTION:On a base film 1, a surface copper circuit 4 and a rear circuit 5 are formed on a surface bonding agent 2 and a rear bonding agent 3, and the surface and rear copper circuits 4, 5 are electrically connected with respect to the surface and the rear in the non-flexing part of the wiring board by a throughhole plating layer 6. The surface copper circuit 4, in at least part becoming the flexing part, is applied with an insulating film cover-lay 7 with a bonding agent 8 for film covering being interposed, and in the rear, it is applied with an insulating film cover-lay 7' from the flexing part end to the non-flexing part with a bonding agent 8' for film covering being interposed. With this, excellent flexing characteristics are obtained, and since there is no bonding agent layer on the rear of the base film, the occurrence of cracks of the bonding agent is eliminated.
JP62202495A 1987-08-12 1987-08-12 Flexible double-sided wiring board manufacturing method Expired - Fee Related JPH07120851B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62202495A JPH07120851B2 (en) 1987-08-12 1987-08-12 Flexible double-sided wiring board manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62202495A JPH07120851B2 (en) 1987-08-12 1987-08-12 Flexible double-sided wiring board manufacturing method

Publications (2)

Publication Number Publication Date
JPS6445196A true JPS6445196A (en) 1989-02-17
JPH07120851B2 JPH07120851B2 (en) 1995-12-20

Family

ID=16458436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62202495A Expired - Fee Related JPH07120851B2 (en) 1987-08-12 1987-08-12 Flexible double-sided wiring board manufacturing method

Country Status (1)

Country Link
JP (1) JPH07120851B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007317873A (en) * 2006-05-25 2007-12-06 Sharp Corp Printed wiring board manufacturing method and printed wiring board inspection pattern unit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5468974A (en) * 1977-11-11 1979-06-02 Hitachi Ltd Preparation of printing plug board
JPS6112094A (en) * 1984-06-27 1986-01-20 日本メクトロン株式会社 Flexible circuit board and method of producing same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5468974A (en) * 1977-11-11 1979-06-02 Hitachi Ltd Preparation of printing plug board
JPS6112094A (en) * 1984-06-27 1986-01-20 日本メクトロン株式会社 Flexible circuit board and method of producing same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007317873A (en) * 2006-05-25 2007-12-06 Sharp Corp Printed wiring board manufacturing method and printed wiring board inspection pattern unit

Also Published As

Publication number Publication date
JPH07120851B2 (en) 1995-12-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees