JPS644612A - Preparation of phenol resin - Google Patents

Preparation of phenol resin

Info

Publication number
JPS644612A
JPS644612A JP15906287A JP15906287A JPS644612A JP S644612 A JPS644612 A JP S644612A JP 15906287 A JP15906287 A JP 15906287A JP 15906287 A JP15906287 A JP 15906287A JP S644612 A JPS644612 A JP S644612A
Authority
JP
Japan
Prior art keywords
phenol resin
silicone polymer
epoxy
methylimidazole
cured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15906287A
Other languages
Japanese (ja)
Inventor
Naokatsu Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP15906287A priority Critical patent/JPS644612A/en
Publication of JPS644612A publication Critical patent/JPS644612A/en
Pending legal-status Critical Current

Links

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  • Phenolic Resins Or Amino Resins (AREA)

Abstract

PURPOSE:To obtain a phenol resin giving a cured substance whose water resistance is improved, by reacting a phenol resin with an epoxy-modified silicone polymer. CONSTITUTION:A phenol resin is reacted with an epoxy-modified silicone polymer by melting the phenol resin and a reactive catalyst (e.g., 2-methylimidazole) and adding the silicone polymer thereto to react with each other under heating. As the ratio of these cpd. to be used, 0.0001-0.001mol. of 2-methylimidazole and 0.05-0.5mol. of epoxy groups of the silicone polymer per mol. of the OH group of the phenol resin are used. The reaction temp. and time are 100-160 deg.C and 3-60min, respectively. The phenol resin thus obtd. can be cured by conventional methods and the cured substance has excellent water resistance.
JP15906287A 1987-06-25 1987-06-25 Preparation of phenol resin Pending JPS644612A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15906287A JPS644612A (en) 1987-06-25 1987-06-25 Preparation of phenol resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15906287A JPS644612A (en) 1987-06-25 1987-06-25 Preparation of phenol resin

Publications (1)

Publication Number Publication Date
JPS644612A true JPS644612A (en) 1989-01-09

Family

ID=15685384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15906287A Pending JPS644612A (en) 1987-06-25 1987-06-25 Preparation of phenol resin

Country Status (1)

Country Link
JP (1) JPS644612A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0430254A3 (en) * 1989-11-30 1992-07-08 Dow Corning Toray Silicone Company, Limited Curable epoxy resin compositions
WO2024224984A1 (en) * 2023-04-28 2024-10-31 Dic株式会社 Composite resin and method for producing same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5993729A (en) * 1982-11-22 1984-05-30 Hitachi Ltd Silicone phenolic compound, its preparation and composition
JPS59172541A (en) * 1983-03-23 1984-09-29 Sumitomo Bakelite Co Ltd Mold-releasable resin composition
JPS6250324A (en) * 1985-08-29 1987-03-05 Hitachi Chem Co Ltd Epoxy resin molding material for sealing electronic component
JPS6346216A (en) * 1986-04-11 1988-02-27 Mitsubishi Electric Corp Epoxy resin composition for semiconductor sealing use

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5993729A (en) * 1982-11-22 1984-05-30 Hitachi Ltd Silicone phenolic compound, its preparation and composition
JPS59172541A (en) * 1983-03-23 1984-09-29 Sumitomo Bakelite Co Ltd Mold-releasable resin composition
JPS6250324A (en) * 1985-08-29 1987-03-05 Hitachi Chem Co Ltd Epoxy resin molding material for sealing electronic component
JPS6346216A (en) * 1986-04-11 1988-02-27 Mitsubishi Electric Corp Epoxy resin composition for semiconductor sealing use

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0430254A3 (en) * 1989-11-30 1992-07-08 Dow Corning Toray Silicone Company, Limited Curable epoxy resin compositions
WO2024224984A1 (en) * 2023-04-28 2024-10-31 Dic株式会社 Composite resin and method for producing same

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