JPS644628A - Copper-clad epoxy resin laminate - Google Patents

Copper-clad epoxy resin laminate

Info

Publication number
JPS644628A
JPS644628A JP15751587A JP15751587A JPS644628A JP S644628 A JPS644628 A JP S644628A JP 15751587 A JP15751587 A JP 15751587A JP 15751587 A JP15751587 A JP 15751587A JP S644628 A JPS644628 A JP S644628A
Authority
JP
Japan
Prior art keywords
obtd
epoxy resin
component
paper
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15751587A
Other languages
Japanese (ja)
Inventor
Hideki Maezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Corp filed Critical Toshiba Chemical Corp
Priority to JP15751587A priority Critical patent/JPS644628A/en
Publication of JPS644628A publication Critical patent/JPS644628A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE:To obtain the title laminate which is excellent in punchability, moisture resistance and heat (soldering) resistance, by consolidating a plurality of prepreg sheets obtd. by impregnating paper or cloth substrates with a resin composition consisting of an epoxy resin, a specified curing agent and a cure accelerator together with copper foil which is placed at least on one side of said sheet into a laminate molding. CONSTITUTION:A resin composition B is obtd. by blending an epoxy resin having at least two epoxy groups in a molecule (a) with a dicyclopentadiene- phenol resin of the formula as shown (where n is 0-10) as a curing agent (b) in an equivalent ratio of the OH groups of the component (b) to the epoxy groups of the component (a) of 0.3-1.1 and adding thereto a cure accelerator such as imidazoles (c). A plurality of prepreg sheets, obtd. by impregnating paper or cloth substrates A such as (non-)woven glass fabric, (cotton) linter paper or kraft paper with the component B and drying the, are laminated together with copper foil which is placed at least on one side of said sheet, and the layers are consolidated into a laminate molding under application of heat and pressure.
JP15751587A 1987-06-26 1987-06-26 Copper-clad epoxy resin laminate Pending JPS644628A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15751587A JPS644628A (en) 1987-06-26 1987-06-26 Copper-clad epoxy resin laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15751587A JPS644628A (en) 1987-06-26 1987-06-26 Copper-clad epoxy resin laminate

Publications (1)

Publication Number Publication Date
JPS644628A true JPS644628A (en) 1989-01-09

Family

ID=15651363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15751587A Pending JPS644628A (en) 1987-06-26 1987-06-26 Copper-clad epoxy resin laminate

Country Status (1)

Country Link
JP (1) JPS644628A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4110219A1 (en) * 1991-03-28 1992-10-01 Huels Troisdorf METHOD FOR PRODUCING PREPREGS WITH SOLVENT-FREE EPOXY RESIN
JPH05156130A (en) * 1991-12-04 1993-06-22 Shin Kobe Electric Mach Co Ltd Laminated resin composition and laminated board
JPH06100660A (en) * 1992-09-22 1994-04-12 Sumitomo Chem Co Ltd Epoxy resin composition and copper-clad laminate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6253342A (en) * 1985-09-03 1987-03-09 Mitsubishi Gas Chem Co Inc Manufacturing method of epoxy resin laminate
JPS62135539A (en) * 1985-12-09 1987-06-18 Sanyo Kokusaku Pulp Co Ltd Epoxy resin laminate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6253342A (en) * 1985-09-03 1987-03-09 Mitsubishi Gas Chem Co Inc Manufacturing method of epoxy resin laminate
JPS62135539A (en) * 1985-12-09 1987-06-18 Sanyo Kokusaku Pulp Co Ltd Epoxy resin laminate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4110219A1 (en) * 1991-03-28 1992-10-01 Huels Troisdorf METHOD FOR PRODUCING PREPREGS WITH SOLVENT-FREE EPOXY RESIN
JPH05156130A (en) * 1991-12-04 1993-06-22 Shin Kobe Electric Mach Co Ltd Laminated resin composition and laminated board
JPH06100660A (en) * 1992-09-22 1994-04-12 Sumitomo Chem Co Ltd Epoxy resin composition and copper-clad laminate

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