JPS6447090A - Circuit board - Google Patents

Circuit board

Info

Publication number
JPS6447090A
JPS6447090A JP20475887A JP20475887A JPS6447090A JP S6447090 A JPS6447090 A JP S6447090A JP 20475887 A JP20475887 A JP 20475887A JP 20475887 A JP20475887 A JP 20475887A JP S6447090 A JPS6447090 A JP S6447090A
Authority
JP
Japan
Prior art keywords
substrate
connector
electrode
conduction
captioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20475887A
Other languages
Japanese (ja)
Inventor
Satoshi Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP20475887A priority Critical patent/JPS6447090A/en
Publication of JPS6447090A publication Critical patent/JPS6447090A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To assure repeated use of the captioned capacitor without the need of a connector and without requiring a process of manufacture where conduction wiring is effected by providing resiliency such as in a spring to part of wiring as an electrode with the aid of the material and structure of a substrate. CONSTITUTION:An electrode 2 formed integrally with a body is constructed in the form of a resilient circular arc-shaped protrusion, on the upper surface of which a conduction pattern 3 is formed. Vertical conduction of a substrate 1 with another substrate 4 is established by fixedly mounting the upper substrate 4 such that it presses down the resilient electrode 2. Such vertical conduction can be established if necessary only by positioning and fixing without the need of a connector, an external parts because of a connector being integrally formed with the circuit board and without any particular process, thereby assuring repeated use of the captioned capacitor and hence facilitating the exchange of substrates and change of the same.
JP20475887A 1987-08-18 1987-08-18 Circuit board Pending JPS6447090A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20475887A JPS6447090A (en) 1987-08-18 1987-08-18 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20475887A JPS6447090A (en) 1987-08-18 1987-08-18 Circuit board

Publications (1)

Publication Number Publication Date
JPS6447090A true JPS6447090A (en) 1989-02-21

Family

ID=16495862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20475887A Pending JPS6447090A (en) 1987-08-18 1987-08-18 Circuit board

Country Status (1)

Country Link
JP (1) JPS6447090A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5002493A (en) * 1989-09-19 1991-03-26 Amp Incorporated Panel mounted electronic assembly
US6705876B2 (en) * 1998-07-13 2004-03-16 Formfactor, Inc. Electrical interconnect assemblies and methods
US6759311B2 (en) 2001-10-31 2004-07-06 Formfactor, Inc. Fan out of interconnect elements attached to semiconductor wafer
US6811406B2 (en) 2001-04-12 2004-11-02 Formfactor, Inc. Microelectronic spring with additional protruding member
US7063541B2 (en) 1997-03-17 2006-06-20 Formfactor, Inc. Composite microelectronic spring structure and method for making same
US7084650B2 (en) 2002-12-16 2006-08-01 Formfactor, Inc. Apparatus and method for limiting over travel in a probe card assembly

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5002493A (en) * 1989-09-19 1991-03-26 Amp Incorporated Panel mounted electronic assembly
US7063541B2 (en) 1997-03-17 2006-06-20 Formfactor, Inc. Composite microelectronic spring structure and method for making same
US6705876B2 (en) * 1998-07-13 2004-03-16 Formfactor, Inc. Electrical interconnect assemblies and methods
US6948941B2 (en) 1998-07-13 2005-09-27 Formfactor, Inc. Interconnect assemblies and methods
US6811406B2 (en) 2001-04-12 2004-11-02 Formfactor, Inc. Microelectronic spring with additional protruding member
US6759311B2 (en) 2001-10-31 2004-07-06 Formfactor, Inc. Fan out of interconnect elements attached to semiconductor wafer
US7084650B2 (en) 2002-12-16 2006-08-01 Formfactor, Inc. Apparatus and method for limiting over travel in a probe card assembly
US7482822B2 (en) 2002-12-16 2009-01-27 Formfactor, Inc. Apparatus and method for limiting over travel in a probe card assembly

Similar Documents

Publication Publication Date Title
ATE71237T1 (en) COMPONENT IN CHIP CONSTRUCTION FOR MOUNTING ON A CIRCUIT BOARD, WITH AN ELECTRICAL OR ELECTRONIC FUNCTIONAL BODY.
JPH0546095U (en) Shield plate for PCB mounting
GB2341277A (en) An electronic component package with posts on the active surface
JPS57111969A (en) Multipole connector
US4923404A (en) Sealed chip carrier
EP0735623A3 (en) Electrical connector
JPS6447090A (en) Circuit board
JPS5993155U (en) Electronic equipment with solar cells
GB2202994B (en) Circuit assembly, e.g. for an electronic timepiece
DE3865323D1 (en) SOCKET.
IL105753A (en) Printed circuit substrates
GB2054915B (en) Electronic timepiece assembly
DE3662735D1 (en) Battery holder for flat assembly modules
JPS5789331A (en) Tuner device
JPS6484582A (en) Mounting structure of printed substrate
JPS6187430U (en)
KR910002567Y1 (en) A unit structure radiating plate for transistor
JPS6489421A (en) Surface mounting type electronic part and manufacture thereof
JPS5833742Y2 (en) Lead contact conduction structure on circuit board
TW348366B (en) Method of removably mounting electronic components to a circuit board, and sockets formed by the methods
JPS649686A (en) Mounting structure of circuit board
JPS562584A (en) Fitting structure of electronic parts for wrist watch
JPS6451519A (en) Manufacture of grid substrate of digitizer
JPS5769214A (en) Electronic counter
JPH0423192U (en)