JPS6447867A - Target structure for planar magnetron sputtering - Google Patents

Target structure for planar magnetron sputtering

Info

Publication number
JPS6447867A
JPS6447867A JP20230087A JP20230087A JPS6447867A JP S6447867 A JPS6447867 A JP S6447867A JP 20230087 A JP20230087 A JP 20230087A JP 20230087 A JP20230087 A JP 20230087A JP S6447867 A JPS6447867 A JP S6447867A
Authority
JP
Japan
Prior art keywords
target
thin film
backing plate
magnetron sputtering
planar magnetron
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20230087A
Other languages
Japanese (ja)
Inventor
Takashi Hase
Hiroshi Kajikawa
Kozo Nishimura
Shigeki Tojo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP20230087A priority Critical patent/JPS6447867A/en
Publication of JPS6447867A publication Critical patent/JPS6447867A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To easily and inexpensively improve the sputtering efficiency and utilization efficiency of a target by shielding the adjoining surfaces of the target arranged on a backing plate and a ferromagnetic yoke on the outer edge of the target with a superconductive thin film. CONSTITUTION:The ferromagnetic yoke 9 is provided on the outer edge of the target 1 arranged on the backing plate 8, and magnets and a shaft 3 are arranged below the backing plate 8 with the N-S poles of the magnets alternately arranged. In the structure for planar magnetron sputtering, the adjoining surfaces of the yoke 9 and the target 1 are shielded with the superconductive thin film 11 of Y-Ba-Cu-O, etc. The leakage of the magnetic flux into the target 1 is prevented by the superconductive thin film due to its Meissner effect. As a result, the density of lines of magnetic force 4 in parallel with the surface of the target 1 is increased, the sputtering efficiency is improved, the parallelism of the lines of magnetic force 4 is enhanced, and the utilization efficiency of the target 1 is improved.
JP20230087A 1987-08-13 1987-08-13 Target structure for planar magnetron sputtering Pending JPS6447867A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20230087A JPS6447867A (en) 1987-08-13 1987-08-13 Target structure for planar magnetron sputtering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20230087A JPS6447867A (en) 1987-08-13 1987-08-13 Target structure for planar magnetron sputtering

Publications (1)

Publication Number Publication Date
JPS6447867A true JPS6447867A (en) 1989-02-22

Family

ID=16455264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20230087A Pending JPS6447867A (en) 1987-08-13 1987-08-13 Target structure for planar magnetron sputtering

Country Status (1)

Country Link
JP (1) JPS6447867A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01104771A (en) * 1987-10-14 1989-04-21 Anelva Corp Plate magnetron sputtering device
US6120489A (en) * 1995-10-10 2000-09-19 The Procter & Gamble Company Flangeless seam for use in disposable articles
US6333834B1 (en) 1992-11-13 2001-12-25 Syquest Technology, Inc. Rattle reduction mechanism in a removable cartridge for a disk drive
JP2006124760A (en) * 2004-10-27 2006-05-18 Aisin Seiki Co Ltd Superconducting magnetic field generator, sputter gun, and sputtering film forming apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01104771A (en) * 1987-10-14 1989-04-21 Anelva Corp Plate magnetron sputtering device
US6333834B1 (en) 1992-11-13 2001-12-25 Syquest Technology, Inc. Rattle reduction mechanism in a removable cartridge for a disk drive
US6120489A (en) * 1995-10-10 2000-09-19 The Procter & Gamble Company Flangeless seam for use in disposable articles
JP2006124760A (en) * 2004-10-27 2006-05-18 Aisin Seiki Co Ltd Superconducting magnetic field generator, sputter gun, and sputtering film forming apparatus

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