JPS6448038U - - Google Patents
Info
- Publication number
- JPS6448038U JPS6448038U JP14256487U JP14256487U JPS6448038U JP S6448038 U JPS6448038 U JP S6448038U JP 14256487 U JP14256487 U JP 14256487U JP 14256487 U JP14256487 U JP 14256487U JP S6448038 U JPS6448038 U JP S6448038U
- Authority
- JP
- Japan
- Prior art keywords
- dual
- line package
- view
- bumper
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000009977 dual effect Effects 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図、第３図、第４図は、本考案によるデユ
アルインラインパツケージを示し、ａは平面図、
ｂは側面図である。第２図及び第７図は、自動実
装用マガジンケース２に部品を入れた状態を示す
断面図である。第５図は、基板に部品を実装した
例を示す側面図である。第６図は、従来のデユア
ルインラインパツケージを示す平面図ａと側面図
ｂである。
１……デユアルインラインパツケージ本体、２
……マガジンケース、１０……デユアルインライ
ンパツケージに設けたバンパー、１Ａ，１Ｂ，１
Ｃ……デユアルインラインパツケージの半導体部
品、Ａ……マガジンケースの部品スルーホール高
さ寸法。
1, 3 and 4 show a dual in-line package according to the present invention, a is a plan view,
b is a side view. FIGS. 2 and 7 are cross-sectional views showing a state in which components are placed in the magazine case 2 for automatic mounting. FIG. 5 is a side view showing an example in which components are mounted on a board. FIG. 6 is a plan view a and a side view b showing a conventional dual in-line package. 1...Dual inline package body, 2
...Magazine case, 10...Bumper provided on dual inline package cage, 1A, 1B, 1
C...Semiconductor components of dual inline package cage, A...Height dimensions of component through-holes of magazine case.
Claims (1)
ないパツケージ側面にバンパーを設けたことを特
徴とするデユアルインラインパツケージ形半導体
装置。 A dual in-line package type semiconductor device characterized in that a bumper is provided on the side surface of the dual in-line package where the terminals do not come out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14256487U JPS6448038U (en) | 1987-09-18 | 1987-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14256487U JPS6448038U (en) | 1987-09-18 | 1987-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448038U true JPS6448038U (en) | 1989-03-24 |
Family
ID=31408631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14256487U Pending JPS6448038U (en) | 1987-09-18 | 1987-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448038U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7304489B2 (en) | 2000-08-21 | 2007-12-04 | Tokyo Electron Limited | Inspection method and inspection apparatus |
-
1987
- 1987-09-18 JP JP14256487U patent/JPS6448038U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7304489B2 (en) | 2000-08-21 | 2007-12-04 | Tokyo Electron Limited | Inspection method and inspection apparatus |
| US7319339B2 (en) | 2000-08-21 | 2008-01-15 | Tokyo Electron Limited | Inspection apparatus to break the oxide of an electrode by fritting phenomenon |