JPS6448493A - Manufacture of flexible printed wiring board - Google Patents

Manufacture of flexible printed wiring board

Info

Publication number
JPS6448493A
JPS6448493A JP20594687A JP20594687A JPS6448493A JP S6448493 A JPS6448493 A JP S6448493A JP 20594687 A JP20594687 A JP 20594687A JP 20594687 A JP20594687 A JP 20594687A JP S6448493 A JPS6448493 A JP S6448493A
Authority
JP
Japan
Prior art keywords
polymide
circuit board
circuit
layer
conductive circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20594687A
Other languages
Japanese (ja)
Inventor
Koji Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP20594687A priority Critical patent/JPS6448493A/en
Publication of JPS6448493A publication Critical patent/JPS6448493A/en
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To allow an accurate soldering and improve thermal resistance, sealability, flexibility, and electric insulation by coating with a photosensitive polymide precursor, exposing, and developing a circuit board wherein a conductive circuit is formed. CONSTITUTION:A circuit board P is formed wherein a polymide layer 1 is formed on a metal thin film 2 such as a copper film, and a conductive circuit having a desired circuit pattern by means of etching, etc., is formed on the metal thin film 2, and then such conductive circuit is coated with a photosensitive polymide precursor 3. The polymide precursor 3 is exposed to a predetermined pattern 4 corresponding to a land part, and it is developed and heated for imidation. As a result, a predetermined part of the circuit board P is coated with an organic insulating film 5 consisting of polymide. In this way, no adhesive layer is required between the conductive circuit of the circuit board P and the polymide layer 1 and organic insulating layer 5. According to the constitution, not only thermal resistance, sealability against the circuit board P, flexibility, and electric insulation are improved greatly but also accuracy of soldering can be enhanced.
JP20594687A 1987-08-19 1987-08-19 Manufacture of flexible printed wiring board Pending JPS6448493A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20594687A JPS6448493A (en) 1987-08-19 1987-08-19 Manufacture of flexible printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20594687A JPS6448493A (en) 1987-08-19 1987-08-19 Manufacture of flexible printed wiring board

Publications (1)

Publication Number Publication Date
JPS6448493A true JPS6448493A (en) 1989-02-22

Family

ID=16515331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20594687A Pending JPS6448493A (en) 1987-08-19 1987-08-19 Manufacture of flexible printed wiring board

Country Status (1)

Country Link
JP (1) JPS6448493A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368393A (en) * 2001-06-05 2002-12-20 Toray Eng Co Ltd Method for manufacturing metal wiring circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368393A (en) * 2001-06-05 2002-12-20 Toray Eng Co Ltd Method for manufacturing metal wiring circuit board

Similar Documents

Publication Publication Date Title
ES8607673A1 (en) Method for the production of flexible printed circuit boards for high bending strain with conductive through-holes.
GB1478341A (en) Printed circuit board and method of making the same
SE8003203L (en) SUBSTRATE MATERIAL AND PROCEDURE FOR MANUFACTURING PRINTED COUPLINGS
GB1062636A (en) Electronic circuit element and method of manufacture
DE3586422D1 (en) ELECTRICALLY CONDUCTING COPPER LAYERS AND METHOD FOR PRODUCING THE SAME.
JPS5618448A (en) Composite electronic part
JPS6448493A (en) Manufacture of flexible printed wiring board
JPS57208158A (en) Manufacture of multilayer wiring structure
JPS6448492A (en) Manufacture of flexible printed wiring board
ES514171A0 (en) "PROCEDURE FOR THE MANUFACTURE OF CIRCUIT BOARDS CONTAINING IN THE INTEGRATED STATE ELECTRICAL RESISTORS AND-OR PLACES OF SWITCHING CONTACTS".
GB1256344A (en) Photographic manufacture of printed circuits
GB2324753B (en) Printed circuit and printed wiring boards and methods of manufacture
SE9600085D0 (en) Shielding of electronic components that are baked directly on PCBs
JPS58134497A (en) Method of producing printed circuit board and printed circuit board
JPS575356A (en) Hybrid integrated circuit device
JPS58207696A (en) Method of producing printed circuit board by plating pattern
SE8702704L (en) SET FOR MANUFACTURE OF A PATTERN CARD AND DEVICE FOR USE IN IMPLEMENTATION OF THE SET
EP0171630A3 (en) System for producing high resolution circuit lines on a printed circuit board
JPS5643746A (en) Lead-less hybrid integrated circuit parts
JPS53138056A (en) Method of coating resin layer on printed circuit board metal material substrate having through hole
KR950001266B1 (en) Method of manufacturing aluminum circuit board
JPS6489594A (en) Manufacture of wiring board
JPS6464292A (en) Manufacture of printed board
JPH0224395B2 (en)
JPH0410753B2 (en)