JPS645043A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS645043A
JPS645043A JP16165787A JP16165787A JPS645043A JP S645043 A JPS645043 A JP S645043A JP 16165787 A JP16165787 A JP 16165787A JP 16165787 A JP16165787 A JP 16165787A JP S645043 A JPS645043 A JP S645043A
Authority
JP
Japan
Prior art keywords
resin
around
difference
thermal expansion
coat film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16165787A
Other languages
Japanese (ja)
Inventor
Yoshiki Takeda
Mitsuharu Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP16165787A priority Critical patent/JPS645043A/en
Publication of JPS645043A publication Critical patent/JPS645043A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent creation of a gap between a metallic member sealed within resin and the resin around the member, by covering the surface of the member with a coat film for absorbing any difference in thermal expansion or contraction between the member and the resin. CONSTITUTION:The surface of a metallic member 5 sealed within resin 3 is covered with a coat film 7 so that the film 7 improves adhesion properties between the member 5 and the resin 3 and absorbs any difference in thermal expansion or contration between the member 5 and the resin 4. The coat film 7 thus serves as a buffer and absorbs any difference in thermal expansion or contraction caused between the member 5 and the resin 3 around the member 5. Accordingly, even if the member 5 or the resin 3 around the member 5 is thermally expanded or contracted, it is possible to prevent slippage of the resin 3 around the member 5, deterioration in adhesion properties between the member 5 and the resin 3 therearound and creation of a gap between the member 5 and the resin 3.
JP16165787A 1987-06-29 1987-06-29 Semiconductor device Pending JPS645043A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16165787A JPS645043A (en) 1987-06-29 1987-06-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16165787A JPS645043A (en) 1987-06-29 1987-06-29 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS645043A true JPS645043A (en) 1989-01-10

Family

ID=15739352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16165787A Pending JPS645043A (en) 1987-06-29 1987-06-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS645043A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0662244A4 (en) * 1992-09-17 1995-09-13 Olin Corp PLASTIC HOUSING CONTAINING SEMICONDUCTORS WITH ALUMINUM HEAT DIFFUSER.
WO2023203754A1 (en) * 2022-04-22 2023-10-26 三菱電機株式会社 Capacitor unit and electronic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0662244A4 (en) * 1992-09-17 1995-09-13 Olin Corp PLASTIC HOUSING CONTAINING SEMICONDUCTORS WITH ALUMINUM HEAT DIFFUSER.
WO2023203754A1 (en) * 2022-04-22 2023-10-26 三菱電機株式会社 Capacitor unit and electronic device
JPWO2023203754A1 (en) * 2022-04-22 2023-10-26

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