JPS645043A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS645043A JPS645043A JP16165787A JP16165787A JPS645043A JP S645043 A JPS645043 A JP S645043A JP 16165787 A JP16165787 A JP 16165787A JP 16165787 A JP16165787 A JP 16165787A JP S645043 A JPS645043 A JP S645043A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- around
- difference
- thermal expansion
- coat film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000011347 resin Substances 0.000 abstract 11
- 229920005989 resin Polymers 0.000 abstract 11
- 230000008602 contraction Effects 0.000 abstract 2
- 230000006866 deterioration Effects 0.000 abstract 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To prevent creation of a gap between a metallic member sealed within resin and the resin around the member, by covering the surface of the member with a coat film for absorbing any difference in thermal expansion or contraction between the member and the resin. CONSTITUTION:The surface of a metallic member 5 sealed within resin 3 is covered with a coat film 7 so that the film 7 improves adhesion properties between the member 5 and the resin 3 and absorbs any difference in thermal expansion or contration between the member 5 and the resin 4. The coat film 7 thus serves as a buffer and absorbs any difference in thermal expansion or contraction caused between the member 5 and the resin 3 around the member 5. Accordingly, even if the member 5 or the resin 3 around the member 5 is thermally expanded or contracted, it is possible to prevent slippage of the resin 3 around the member 5, deterioration in adhesion properties between the member 5 and the resin 3 therearound and creation of a gap between the member 5 and the resin 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16165787A JPS645043A (en) | 1987-06-29 | 1987-06-29 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16165787A JPS645043A (en) | 1987-06-29 | 1987-06-29 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS645043A true JPS645043A (en) | 1989-01-10 |
Family
ID=15739352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16165787A Pending JPS645043A (en) | 1987-06-29 | 1987-06-29 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS645043A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0662244A4 (en) * | 1992-09-17 | 1995-09-13 | Olin Corp | PLASTIC HOUSING CONTAINING SEMICONDUCTORS WITH ALUMINUM HEAT DIFFUSER. |
| WO2023203754A1 (en) * | 2022-04-22 | 2023-10-26 | 三菱電機株式会社 | Capacitor unit and electronic device |
-
1987
- 1987-06-29 JP JP16165787A patent/JPS645043A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0662244A4 (en) * | 1992-09-17 | 1995-09-13 | Olin Corp | PLASTIC HOUSING CONTAINING SEMICONDUCTORS WITH ALUMINUM HEAT DIFFUSER. |
| WO2023203754A1 (en) * | 2022-04-22 | 2023-10-26 | 三菱電機株式会社 | Capacitor unit and electronic device |
| JPWO2023203754A1 (en) * | 2022-04-22 | 2023-10-26 |
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