JPS6450501A - Manufacture of thin film thermistor - Google Patents

Manufacture of thin film thermistor

Info

Publication number
JPS6450501A
JPS6450501A JP20647587A JP20647587A JPS6450501A JP S6450501 A JPS6450501 A JP S6450501A JP 20647587 A JP20647587 A JP 20647587A JP 20647587 A JP20647587 A JP 20647587A JP S6450501 A JPS6450501 A JP S6450501A
Authority
JP
Japan
Prior art keywords
film
gas atmosphere
plasma
substrate
composite oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20647587A
Other languages
Japanese (ja)
Other versions
JP2587426B2 (en
Inventor
Toshiyuki Nojiri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ISHIZUKA DENSHI KK
Original Assignee
ISHIZUKA DENSHI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ISHIZUKA DENSHI KK filed Critical ISHIZUKA DENSHI KK
Priority to JP20647587A priority Critical patent/JP2587426B2/en
Publication of JPS6450501A publication Critical patent/JPS6450501A/en
Application granted granted Critical
Publication of JP2587426B2 publication Critical patent/JP2587426B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Thermistors And Varistors (AREA)

Abstract

PURPOSE:To perform the formation of a film and a heat treatment at a low temperature, to achieve the formation of the film on a substrate of all materials and to obtain a method having a fast film forming velocity by depositing a composite oxide thin film by high frequency sputtering in an Ar atmosphere with a specific composite oxide target, and then plasma-treating in an oxidative gas atmosphere. CONSTITUTION:After a composite oxide thin film 2 is deposited by high frequency sputtering on a substrate 1 in an argon gas atmosphere with a composite oxide target made of oxide to which Ni, Fe, Cu, etc., are added to Mn, Co, the film 2 is plasma-treated to be oxidized in an oxidative gas atmosphere. For example, a target made of sintered oxide like that having, for example, 3:2:1 of Mn:Co:Ni is employed, and the film 2 is formed on an alumina substrate 1 under the conditions of 300 deg.C of substrate temperature and 5mum/hr of film growing speed in an argon gas atmosphere by a high frequency sputtering device. Then, a plasma reactor is employed, a plasma is generated in an oxygen gas atmosphere of 0.5 Torr, a plasma treating is conducted without heating the substrate, and electrodes 3 are then formed.
JP20647587A 1987-08-21 1987-08-21 Manufacturing method of thin film thermistor Expired - Fee Related JP2587426B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20647587A JP2587426B2 (en) 1987-08-21 1987-08-21 Manufacturing method of thin film thermistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20647587A JP2587426B2 (en) 1987-08-21 1987-08-21 Manufacturing method of thin film thermistor

Publications (2)

Publication Number Publication Date
JPS6450501A true JPS6450501A (en) 1989-02-27
JP2587426B2 JP2587426B2 (en) 1997-03-05

Family

ID=16523992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20647587A Expired - Fee Related JP2587426B2 (en) 1987-08-21 1987-08-21 Manufacturing method of thin film thermistor

Country Status (1)

Country Link
JP (1) JP2587426B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6368734B1 (en) 1998-11-06 2002-04-09 Murata Manufacturing Co., Ltd. NTC thermistors and NTC thermistor chips
JP2008244018A (en) * 2007-03-26 2008-10-09 Ulvac Japan Ltd Manufacturing method of semiconductor device
CN111436166A (en) * 2019-01-11 2020-07-21 东芝照明技术株式会社 Heater and image forming apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6368734B1 (en) 1998-11-06 2002-04-09 Murata Manufacturing Co., Ltd. NTC thermistors and NTC thermistor chips
JP2008244018A (en) * 2007-03-26 2008-10-09 Ulvac Japan Ltd Manufacturing method of semiconductor device
CN111436166A (en) * 2019-01-11 2020-07-21 东芝照明技术株式会社 Heater and image forming apparatus
JP2020112701A (en) * 2019-01-11 2020-07-27 東芝ライテック株式会社 Heater and image forming device
CN111436166B (en) * 2019-01-11 2024-11-22 东芝照明技术株式会社 Heater and image forming device

Also Published As

Publication number Publication date
JP2587426B2 (en) 1997-03-05

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees