JPS6450593A - High-density printed wiring board and manufacture thereof - Google Patents

High-density printed wiring board and manufacture thereof

Info

Publication number
JPS6450593A
JPS6450593A JP20648987A JP20648987A JPS6450593A JP S6450593 A JPS6450593 A JP S6450593A JP 20648987 A JP20648987 A JP 20648987A JP 20648987 A JP20648987 A JP 20648987A JP S6450593 A JPS6450593 A JP S6450593A
Authority
JP
Japan
Prior art keywords
hole
aperture
small
mounting surface
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20648987A
Other languages
Japanese (ja)
Inventor
Takayuki Chino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP20648987A priority Critical patent/JPS6450593A/en
Publication of JPS6450593A publication Critical patent/JPS6450593A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To obtain a new wiring board to make possible the formation of a high-density wiring by a method wherein a large diameter through hole and a small diameter through hole are respectively perforated on the side of the component mounting surface of an insulating substrate and on the side of the rear of the substrate, a solder resist film is formed on one surface of the small open surface side and one surface of the component mounting surface side excepting the aperture of the large through hole and the land part on the peripheral edge of the aperture and the like. CONSTITUTION:In a printed-wiring board using an insulating substrate 20 provided with large and small two-stage diameter through holes of a large diameter through hole 6 perforated on the side of its component mounting surface and a small diameter through hole 7 perforated on the side of its rear as its base, a conductor-plated layer 8 is provided on at least the inner walls of the through holes and land parts 4 and 5 on the peripheral edges of the apertures. Moreover, a solder resist film 9 is formed on one surface of the small open surface side and one surface of the component mounting surface side excepting the aperture of the large through hole 6 and the land part 4 on the peripheral edge of the aperture of the hole 6 in such a way as to block the aperture of the above small through hole 7. Thereby, even though component terminals 10 are soldered 10 in the through holes, no solder comes out on the side of the noncomponent mounting surface. As a result, the reliability of insulation of high-density signal conductors 12 arranged on this surface is improved.
JP20648987A 1987-08-21 1987-08-21 High-density printed wiring board and manufacture thereof Pending JPS6450593A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20648987A JPS6450593A (en) 1987-08-21 1987-08-21 High-density printed wiring board and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20648987A JPS6450593A (en) 1987-08-21 1987-08-21 High-density printed wiring board and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS6450593A true JPS6450593A (en) 1989-02-27

Family

ID=16524220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20648987A Pending JPS6450593A (en) 1987-08-21 1987-08-21 High-density printed wiring board and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6450593A (en)

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