JPS6453597A - Manufacture of ceramic multilayered board - Google Patents

Manufacture of ceramic multilayered board

Info

Publication number
JPS6453597A
JPS6453597A JP62210491A JP21049187A JPS6453597A JP S6453597 A JPS6453597 A JP S6453597A JP 62210491 A JP62210491 A JP 62210491A JP 21049187 A JP21049187 A JP 21049187A JP S6453597 A JPS6453597 A JP S6453597A
Authority
JP
Japan
Prior art keywords
green sheet
unbaked
baked
board
wiring layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62210491A
Other languages
Japanese (ja)
Other versions
JPH0561799B2 (en
Inventor
Minehiro Itagaki
Osamu Makino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62210491A priority Critical patent/JPS6453597A/en
Publication of JPS6453597A publication Critical patent/JPS6453597A/en
Publication of JPH0561799B2 publication Critical patent/JPH0561799B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Conductive Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To eliminate a short-circuit between wiring layers by a method wherein unbaked wiring layers made of copper oxide paste are formed on a baked ceramic board and, after an insulating layer made of low temperature sintered ceramic material is formed on the baked ceramic substrate, an unbaked green sheet is bonded to it. CONSTITUTION:Wiring layers 2 made of copper oxide paste is screen-printed on a baked alumina board 1 beforehand and dried. Then wiring layers 2 made of copper oxide paste are formed on an unbaked green sheet 4 in which holes are formed at required positions and dried. Insulating paste is applied to the baked alumina board 1 to form a thin unbaked insulating layer 3 and, before the insulating layer 3 is dried, the unbaked green sheet 4 is put on it and the baked ceramic board 1 and the unbaked green sheet 4 are bonded to each other. Then the multilayer board after bonding is heated in the air at 300-700 deg.C to eliminate organic components in the paste and the green sheet completely for debindering. Then, after the copper oxide is reduced into metal copper in a nitrogen gas atmosphere containing 5-40% of hydrogen gas at 300-500 deg.C, the metal copper and the green sheet are baked in a nitrogen gas atmosphere at 850-1000 deg.C.
JP62210491A 1987-08-25 1987-08-25 Manufacture of ceramic multilayered board Granted JPS6453597A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62210491A JPS6453597A (en) 1987-08-25 1987-08-25 Manufacture of ceramic multilayered board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62210491A JPS6453597A (en) 1987-08-25 1987-08-25 Manufacture of ceramic multilayered board

Publications (2)

Publication Number Publication Date
JPS6453597A true JPS6453597A (en) 1989-03-01
JPH0561799B2 JPH0561799B2 (en) 1993-09-07

Family

ID=16590229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62210491A Granted JPS6453597A (en) 1987-08-25 1987-08-25 Manufacture of ceramic multilayered board

Country Status (1)

Country Link
JP (1) JPS6453597A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0529765A (en) * 1990-08-23 1993-02-05 Ngk Insulators Ltd Ceramic multilayer wiring board and manufacture thereof
EP1189495A4 (en) * 2000-03-15 2007-07-04 Matsushita Electric Industrial Co Ltd PROCESS FOR MANUFACTURING MULTI-LAYER CERAMIC SUBSTRATE, AND CONDUCTIVE PASTE

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0529765A (en) * 1990-08-23 1993-02-05 Ngk Insulators Ltd Ceramic multilayer wiring board and manufacture thereof
EP1189495A4 (en) * 2000-03-15 2007-07-04 Matsushita Electric Industrial Co Ltd PROCESS FOR MANUFACTURING MULTI-LAYER CERAMIC SUBSTRATE, AND CONDUCTIVE PASTE

Also Published As

Publication number Publication date
JPH0561799B2 (en) 1993-09-07

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