JPS6457642U - - Google Patents
Info
- Publication number
- JPS6457642U JPS6457642U JP1987151803U JP15180387U JPS6457642U JP S6457642 U JPS6457642 U JP S6457642U JP 1987151803 U JP1987151803 U JP 1987151803U JP 15180387 U JP15180387 U JP 15180387U JP S6457642 U JPS6457642 U JP S6457642U
- Authority
- JP
- Japan
- Prior art keywords
- end surface
- insertion hole
- wire insertion
- wire
- capillary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07168—Means for storing or moving the material for the connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の実施例に係るキヤピラリの斜
視図、第２図は実施例に係るキヤピラリがワイヤ
ボンデイング装置に装着された状態を示す斜視図
、第３図は第２図の―矢視拡大図、第４図は
ワイヤボンデイングの手順をキヤピラリ等を概略
的に示して説明する図である。 ２……ワイヤクランプ、４……（キヤピラリの
）上端面、５……（キヤピラリの）下端面、６…
…ワイヤ通挿孔、６ａ……（ワイヤ通挿孔におけ
る）上端面開口、７……切欠案内部、８……ガイ
ド面、Ｗ……ワイヤ結線体（金線）。
視図、第２図は実施例に係るキヤピラリがワイヤ
ボンデイング装置に装着された状態を示す斜視図
、第３図は第２図の―矢視拡大図、第４図は
ワイヤボンデイングの手順をキヤピラリ等を概略
的に示して説明する図である。 ２……ワイヤクランプ、４……（キヤピラリの
）上端面、５……（キヤピラリの）下端面、６…
…ワイヤ通挿孔、６ａ……（ワイヤ通挿孔におけ
る）上端面開口、７……切欠案内部、８……ガイ
ド面、Ｗ……ワイヤ結線体（金線）。
Claims (1)
- 【実用新案登録請求の範囲】 上端面と下端面との間を軸線方向に延びて貫通
するワイヤ通挿孔を有し、上端面より上方に位置
するワイヤクランプを経由して下方に延びるワイ
ヤ結線体が、上記ワイヤ通挿孔における上端面開
口から上記ワイヤ通挿孔内に案内通挿される略筒
状のキヤピラリにおいて、 その側壁部に、上記ワイヤ通挿孔につながり、
かつ少なくとも上記ワイヤ結線体の経より大なる
間隔をあけて互いに対向しながら上記ワイヤ通挿
孔に向かつて延びる一対のガイド面を有する切欠
案内部を、上端面から、軸線方向中間部に到る所
定の軸線方向長さをもつて設けたことを特徴とす
る、キヤピラリ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987151803U JPS6457642U (ja) | 1987-10-02 | 1987-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987151803U JPS6457642U (ja) | 1987-10-02 | 1987-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6457642U true JPS6457642U (ja) | 1989-04-10 |
Family
ID=31426170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987151803U Pending JPS6457642U (ja) | 1987-10-02 | 1987-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6457642U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6230339B2 (ja) * | 1982-04-01 | 1987-07-01 | Matsushita Electric Ind Co Ltd |
-
1987
- 1987-10-02 JP JP1987151803U patent/JPS6457642U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6230339B2 (ja) * | 1982-04-01 | 1987-07-01 | Matsushita Electric Ind Co Ltd |