JPS645799A - Method of cutting plastic substrate - Google Patents

Method of cutting plastic substrate

Info

Publication number
JPS645799A
JPS645799A JP15963187A JP15963187A JPS645799A JP S645799 A JPS645799 A JP S645799A JP 15963187 A JP15963187 A JP 15963187A JP 15963187 A JP15963187 A JP 15963187A JP S645799 A JPS645799 A JP S645799A
Authority
JP
Japan
Prior art keywords
board
cutting blades
cut
heat
plastic board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15963187A
Other languages
Japanese (ja)
Inventor
Mitsuhiro Takasaki
Ryoichi Sudo
Haruhiko Matsuyama
Eiji Koyama
Hiroya Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Maxell Ltd
Original Assignee
Hitachi Ltd
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Maxell Ltd filed Critical Hitachi Ltd
Priority to JP15963187A priority Critical patent/JPS645799A/en
Publication of JPS645799A publication Critical patent/JPS645799A/en
Pending legal-status Critical Current

Links

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

PURPOSE: To heat only the cut portion of a plastic board and to cut the plastic board with small machining force without deteriorating the characteristics of the board by heating cutting blades to the softening point of a work or above. CONSTITUTION: Heaters 13, 14 are excited to heat cutting blades 11, 12 to the prescribed temperature, and a die plate 7 is depressed to press the cutting blades 11, 12 to the upper face of a plastic board (raw board) 16. The tips of the cutting blades 11, 12 are thrust to the cut portion of the plastic board 16 to heat only this portion, and the board 16 is cut without deteriorating its characteristics.
JP15963187A 1987-06-29 1987-06-29 Method of cutting plastic substrate Pending JPS645799A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15963187A JPS645799A (en) 1987-06-29 1987-06-29 Method of cutting plastic substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15963187A JPS645799A (en) 1987-06-29 1987-06-29 Method of cutting plastic substrate

Publications (1)

Publication Number Publication Date
JPS645799A true JPS645799A (en) 1989-01-10

Family

ID=15697934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15963187A Pending JPS645799A (en) 1987-06-29 1987-06-29 Method of cutting plastic substrate

Country Status (1)

Country Link
JP (1) JPS645799A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04176600A (en) * 1990-11-13 1992-06-24 Denka Polymer Kk Cutting device of thermoplastic resin foam molding and molding manufacturing equipment using the same
JP2015120284A (en) * 2013-12-24 2015-07-02 セイコーエプソン株式会社 Printed material processing method, printed material processing apparatus, and image forming apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04176600A (en) * 1990-11-13 1992-06-24 Denka Polymer Kk Cutting device of thermoplastic resin foam molding and molding manufacturing equipment using the same
JP2015120284A (en) * 2013-12-24 2015-07-02 セイコーエプソン株式会社 Printed material processing method, printed material processing apparatus, and image forming apparatus

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