JPS646014A - Curable composition - Google Patents
Curable compositionInfo
- Publication number
- JPS646014A JPS646014A JP16293887A JP16293887A JPS646014A JP S646014 A JPS646014 A JP S646014A JP 16293887 A JP16293887 A JP 16293887A JP 16293887 A JP16293887 A JP 16293887A JP S646014 A JPS646014 A JP S646014A
- Authority
- JP
- Japan
- Prior art keywords
- component
- meth
- photo
- reaction product
- polymerization initiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polymerisation Methods In General (AREA)
Abstract
PURPOSE:To obtain the titled composition containing a specific reaction product, an ethylenic unsaturated compound and a photo-polymerization initiator, curable with ultraviolet radiation to give a cured article having various excellent properties and suitable for the production of a printed circuit board. CONSTITUTION:The objective composition contains (A) a reaction product of (i) an epoxy(meth)acrylate having >=2 (meth)acryloyl groups in a molecule with (ii) an acid anhydride, (B) an ethylenic unsaturated compound having >=1 (meth) acryl group and (C) a photo-polymerization initiator. The ratio of the hydroxyl group of the component (i) to the acid anhydride of the component (ii) in the component A is preferably 1:(0.9-1.1). The amounts of the components B and C are preferably 20-60pts.wt. and 5-15pts.wt. per 100pts.wt. of the component A, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16293887A JPS646014A (en) | 1987-06-30 | 1987-06-30 | Curable composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16293887A JPS646014A (en) | 1987-06-30 | 1987-06-30 | Curable composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS646014A true JPS646014A (en) | 1989-01-10 |
Family
ID=15764099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16293887A Pending JPS646014A (en) | 1987-06-30 | 1987-06-30 | Curable composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS646014A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0243551A (en) * | 1988-08-04 | 1990-02-14 | Fuji Photo Film Co Ltd | Liquid photosensitive resin composition |
| CN101950128A (en) * | 2010-10-11 | 2011-01-19 | 绵阳信利电子有限公司 | Photosensitive resin for plasma display screen |
| WO2025263173A1 (en) * | 2024-06-17 | 2025-12-26 | Agc株式会社 | Photosensitive thermosetting resin composition, photosensitive coverlay, and flexible printed wiring board |
-
1987
- 1987-06-30 JP JP16293887A patent/JPS646014A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0243551A (en) * | 1988-08-04 | 1990-02-14 | Fuji Photo Film Co Ltd | Liquid photosensitive resin composition |
| CN101950128A (en) * | 2010-10-11 | 2011-01-19 | 绵阳信利电子有限公司 | Photosensitive resin for plasma display screen |
| WO2025263173A1 (en) * | 2024-06-17 | 2025-12-26 | Agc株式会社 | Photosensitive thermosetting resin composition, photosensitive coverlay, and flexible printed wiring board |
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