JPS6460632A - Production of prepreg - Google Patents
Production of prepregInfo
- Publication number
- JPS6460632A JPS6460632A JP21675687A JP21675687A JPS6460632A JP S6460632 A JPS6460632 A JP S6460632A JP 21675687 A JP21675687 A JP 21675687A JP 21675687 A JP21675687 A JP 21675687A JP S6460632 A JPS6460632 A JP S6460632A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin solution
- prepreg
- adhere
- passed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 abstract 8
- 239000011347 resin Substances 0.000 abstract 8
- 239000004744 fabric Substances 0.000 abstract 3
- 238000001035 drying Methods 0.000 abstract 2
- 239000006087 Silane Coupling Agent Substances 0.000 abstract 1
- 230000001464 adherent effect Effects 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920001225 polyester resin Polymers 0.000 abstract 1
- 239000004645 polyester resin Substances 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
- 239000009719 polyimide resin Substances 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
- 239000002966 varnish Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
PURPOSE:To obtain a prepreg which can give a laminated sheet excellent in dimensional stability, low in warp and twist and free of bubbles by molding at a low pressure, by pressing a woven cloth with a nip roll, passing it through a resin solution to adhere the resin solution thereto and drying it. CONSTITUTION:A woven cloth 1 such as a glass cloth surface-treated with a silane coupling agent and wound into a roll is pressed with a nip roll 4 at a pressure of 1-70kg/cm<2> to render it easily impregnatable with a resin solution 2, passed through a resin solution tank 5 filled with a resin solution 2 such as a varnish of a thermosetting resin such as an epoxy resin, a polyester resin or a polyimide resin to adhere the resin to it, passed between, e.g., a pair of rolls to squeeze adherent excessive resin to a specified thickness and led to a drying chamber 3, where it is brought into B stage to obtain a prepreg 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21675687A JPS6460632A (en) | 1987-08-31 | 1987-08-31 | Production of prepreg |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21675687A JPS6460632A (en) | 1987-08-31 | 1987-08-31 | Production of prepreg |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6460632A true JPS6460632A (en) | 1989-03-07 |
Family
ID=16693425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21675687A Pending JPS6460632A (en) | 1987-08-31 | 1987-08-31 | Production of prepreg |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6460632A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5071701A (en) * | 1989-11-22 | 1991-12-10 | B. F. Goodrich Corporation | Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs and processes for preparing such printed circuit wiring boards |
| US7413623B2 (en) * | 2005-02-04 | 2008-08-19 | Rse Industries, Inc. | Apparatus for resin-impregnation of fibers for filament winding |
-
1987
- 1987-08-31 JP JP21675687A patent/JPS6460632A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5071701A (en) * | 1989-11-22 | 1991-12-10 | B. F. Goodrich Corporation | Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs and processes for preparing such printed circuit wiring boards |
| US7413623B2 (en) * | 2005-02-04 | 2008-08-19 | Rse Industries, Inc. | Apparatus for resin-impregnation of fibers for filament winding |
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