JPS6460677A - Acrylic pressure-sensitive adhesive composition - Google Patents

Acrylic pressure-sensitive adhesive composition

Info

Publication number
JPS6460677A
JPS6460677A JP21556287A JP21556287A JPS6460677A JP S6460677 A JPS6460677 A JP S6460677A JP 21556287 A JP21556287 A JP 21556287A JP 21556287 A JP21556287 A JP 21556287A JP S6460677 A JPS6460677 A JP S6460677A
Authority
JP
Japan
Prior art keywords
resin
styrene
compsn
acrylic
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21556287A
Other languages
Japanese (ja)
Other versions
JPH0784579B2 (en
Inventor
Yoshihiro Kodama
Tsukasa Ishimoto
Kiyoshi Kanekawa
Yuichi Tsutsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arakawa Chemical Industries Ltd
Original Assignee
Arakawa Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arakawa Chemical Industries Ltd filed Critical Arakawa Chemical Industries Ltd
Priority to JP21556287A priority Critical patent/JPH0784579B2/en
Publication of JPS6460677A publication Critical patent/JPS6460677A/en
Publication of JPH0784579B2 publication Critical patent/JPH0784579B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:To provide the title compsn. having excellent adhesion to polyolefins, transparency, weather resistance, etc., by blending an acrylic polymer with a specific tackifier resin comprising a styrene polymer and a hydrogenated petroleum resin or the like. CONSTITUTION:A styrene polymer (A) prepd. from a monomer compsn. composed of 100-70wt.% styrene and 0-30wt.% least 5C aliph. mono-olefin and having an average MW of pref. 350-1,500 (e.g., styrene-diisobutylene copolymer) is mixed with a resin (B) selected from hydrogenated petroleum resins and hydrogenated terpene resins to prepare a tackifier resin, which is then blended with an acrylic resin (e.g., butyl acrylate/acrylic acid copolymer) to prepare an acrylic pressure-sensitive adhesive compsn. The obtd. adhesive compsn. is suitably used to produce labels, etc., which are stuck to a wide variety of adherends including polyolefins.
JP21556287A 1987-08-28 1987-08-28 Acrylic pressure sensitive adhesive composition Expired - Fee Related JPH0784579B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21556287A JPH0784579B2 (en) 1987-08-28 1987-08-28 Acrylic pressure sensitive adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21556287A JPH0784579B2 (en) 1987-08-28 1987-08-28 Acrylic pressure sensitive adhesive composition

Publications (2)

Publication Number Publication Date
JPS6460677A true JPS6460677A (en) 1989-03-07
JPH0784579B2 JPH0784579B2 (en) 1995-09-13

Family

ID=16674483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21556287A Expired - Fee Related JPH0784579B2 (en) 1987-08-28 1987-08-28 Acrylic pressure sensitive adhesive composition

Country Status (1)

Country Link
JP (1) JPH0784579B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0578091A3 (en) * 1992-06-29 1994-01-19 Canon Kabushiki Kaisha Resin composition for sealing and semiconductor apparatus covered with the sealing resin composition
WO2010021075A1 (en) 2008-08-20 2010-02-25 シャープ株式会社 Display apparatus and manufacturing method therefor, and active matrix circuit board
JPWO2020262309A1 (en) * 2019-06-25 2020-12-30
JPWO2019124161A1 (en) * 2017-12-22 2021-01-14 日本化薬株式会社 Azo compounds or salts thereof, and polarizing devices, polarizing plates, and display devices containing them.

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001152119A (en) * 1999-11-30 2001-06-05 Nitto Denko Corp Emulsion type pressure-sensitive adhesive composition and pressure-sensitive adhesive tape for sealing ball

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0578091A3 (en) * 1992-06-29 1994-01-19 Canon Kabushiki Kaisha Resin composition for sealing and semiconductor apparatus covered with the sealing resin composition
US5397401A (en) * 1992-06-29 1995-03-14 Canon Kabushiki Kaisha Semiconductor apparatus covered with a sealing resin composition
WO2010021075A1 (en) 2008-08-20 2010-02-25 シャープ株式会社 Display apparatus and manufacturing method therefor, and active matrix circuit board
JPWO2019124161A1 (en) * 2017-12-22 2021-01-14 日本化薬株式会社 Azo compounds or salts thereof, and polarizing devices, polarizing plates, and display devices containing them.
JPWO2020262309A1 (en) * 2019-06-25 2020-12-30
WO2020262309A1 (en) * 2019-06-25 2020-12-30 三井化学株式会社 Adhesive composition and adhesive processed article
TWI853045B (en) * 2019-06-25 2024-08-21 日商三井化學股份有限公司 Adhesive composition and adhesive processed product

Also Published As

Publication number Publication date
JPH0784579B2 (en) 1995-09-13

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees