JPS6464227A - Vessel for semiconductor device - Google Patents

Vessel for semiconductor device

Info

Publication number
JPS6464227A
JPS6464227A JP62221525A JP22152587A JPS6464227A JP S6464227 A JPS6464227 A JP S6464227A JP 62221525 A JP62221525 A JP 62221525A JP 22152587 A JP22152587 A JP 22152587A JP S6464227 A JPS6464227 A JP S6464227A
Authority
JP
Japan
Prior art keywords
semiconductor
crosswise
semiconductor pellets
alignment
mounting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62221525A
Other languages
Japanese (ja)
Inventor
Tomoaki Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62221525A priority Critical patent/JPS6464227A/en
Publication of JPS6464227A publication Critical patent/JPS6464227A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To mount semiconductor pellets accurately at specified positions wihtout dispersion by manual operation by respectively forming a plurality of alignment trenches to a mounting surface lengthwise and crosswise at intervals narrower than a lower limit in the semiconductor pellets. CONSTITUTION:A mounting surface 2 for mounting semiconductor pellets plated with Au is set up to a vessel body 1 composed of a Kovar material, and plural kinds of the semiconductor pellets in different size are mounted singly or in a plurality. A plurality of alignment trenches 21a, 21b are shaped lengthwise and crosswise respectively to the mounting surface 2 in a section paper shape at regular intervals narrower than a lower limit lengthwise and crosswise in plural kinds of the semiconductor pellets. The semiconductor pellet 10 such as a GaAs semiconductor element is mounted with AnSn at a No.2 position from the left of the longitudinal alignment trench 21a and at a No.3 position from the upper section of the lateral alignment trench 21b, using the alignment trenches 21a, 21b as marks, and electrodes for the semiconductor pellet 10 and terminals 3 are connected by bonding wires 11.
JP62221525A 1987-09-03 1987-09-03 Vessel for semiconductor device Pending JPS6464227A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62221525A JPS6464227A (en) 1987-09-03 1987-09-03 Vessel for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62221525A JPS6464227A (en) 1987-09-03 1987-09-03 Vessel for semiconductor device

Publications (1)

Publication Number Publication Date
JPS6464227A true JPS6464227A (en) 1989-03-10

Family

ID=16768079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62221525A Pending JPS6464227A (en) 1987-09-03 1987-09-03 Vessel for semiconductor device

Country Status (1)

Country Link
JP (1) JPS6464227A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368156A (en) * 2001-06-11 2002-12-20 Oki Electric Ind Co Ltd Semiconductor device and manufacturing method thereof
JP2013179238A (en) * 2012-02-29 2013-09-09 Oki Electric Ind Co Ltd Package and power amplifier

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6113937B2 (en) * 1981-01-21 1986-04-16 Shutaruku Geeruharudo
JPS61156753A (en) * 1984-12-27 1986-07-16 Toshiba Corp Casing for semiconductor device
JPS61265842A (en) * 1985-05-20 1986-11-25 Fujitsu Ltd Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6113937B2 (en) * 1981-01-21 1986-04-16 Shutaruku Geeruharudo
JPS61156753A (en) * 1984-12-27 1986-07-16 Toshiba Corp Casing for semiconductor device
JPS61265842A (en) * 1985-05-20 1986-11-25 Fujitsu Ltd Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368156A (en) * 2001-06-11 2002-12-20 Oki Electric Ind Co Ltd Semiconductor device and manufacturing method thereof
US6858947B2 (en) 2001-06-11 2005-02-22 Oki Electric Industry Co., Ltd. Semiconductor device
US7247522B2 (en) 2001-06-11 2007-07-24 Oki Electric Industry Co., Ltd Semiconductor device
JP2013179238A (en) * 2012-02-29 2013-09-09 Oki Electric Ind Co Ltd Package and power amplifier

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