JPS6464290A - Conductor pattern forming method - Google Patents

Conductor pattern forming method

Info

Publication number
JPS6464290A
JPS6464290A JP22167287A JP22167287A JPS6464290A JP S6464290 A JPS6464290 A JP S6464290A JP 22167287 A JP22167287 A JP 22167287A JP 22167287 A JP22167287 A JP 22167287A JP S6464290 A JPS6464290 A JP S6464290A
Authority
JP
Japan
Prior art keywords
conductor pattern
circuit board
jetting head
jetting
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22167287A
Other languages
Japanese (ja)
Inventor
Yutaka Shimabara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP22167287A priority Critical patent/JPS6464290A/en
Publication of JPS6464290A publication Critical patent/JPS6464290A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To form a conductor pattern so as to linearly link to a controlling machine, by moving a jetting head relatively to a circuit board, inputting a required electric signal corresponding with the conductor pattern to the jetting head, jetting a jet liquid from the jetting head, and making conductor pattern material attach to a circuit board. CONSTITUTION:A controlling part 8 reads out the data of a conductor pattern from a storage part 9, and shows the pattern on a display 10. Then the controlling part 8 moves, via a head transferring mechanism 7, a jetting head 5 from a left starting point to a right direction A along the surface of a circuit board 1, and supply electric signal corresponding with the form of the conductor pattern to the jetting head 5. At this time, a holder 2 and the circuit board 1 set at the lowest position, and the jetting head 5 faces the highest position of the circuit board 1. While moving in the right direction A along the highest position of the substrate 1 surface, the jetting head 6 jets a jet liquid 4 containing conductor pattern material. The jetted jet liquid 4 attaches on the surface of the circuit board 1, and forms in the right and left direction a figure corresponding with a part of the conductor pattern, at the highest position of the circuit board 1 surface.
JP22167287A 1987-09-03 1987-09-03 Conductor pattern forming method Pending JPS6464290A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22167287A JPS6464290A (en) 1987-09-03 1987-09-03 Conductor pattern forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22167287A JPS6464290A (en) 1987-09-03 1987-09-03 Conductor pattern forming method

Publications (1)

Publication Number Publication Date
JPS6464290A true JPS6464290A (en) 1989-03-10

Family

ID=16770460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22167287A Pending JPS6464290A (en) 1987-09-03 1987-09-03 Conductor pattern forming method

Country Status (1)

Country Link
JP (1) JPS6464290A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6419746B1 (en) 1994-12-16 2002-07-16 Canon Kabushiki Kaisha Electron-emitting device, electron source substrate, electron source, display panel and image-forming apparatus, and production method thereof
WO1999060829A3 (en) * 1998-05-20 2003-04-17 Intermec Ip Corp Method and apparatus for making electrical traces, circuits and devices
US7354794B2 (en) 2005-02-18 2008-04-08 Lexmark International, Inc. Printed conductive connectors
US7442405B2 (en) 1997-03-21 2008-10-28 Canon Kabushiki Kaisha Method for production of electron source substrate provided with electron emitting element and method for production of electronic device using the substrate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6419746B1 (en) 1994-12-16 2002-07-16 Canon Kabushiki Kaisha Electron-emitting device, electron source substrate, electron source, display panel and image-forming apparatus, and production method thereof
US6511545B2 (en) 1994-12-16 2003-01-28 Canon Kabushiki Kaisha Electron-emitting device, electron source substrate, electron source, display panel and image-forming apparatus, and production method thereof
US6511358B2 (en) 1994-12-16 2003-01-28 Canon Kabushiki Kaisha Electron-emitting device, electron source substrate, electron source, display panel and image-forming apparatus, and production method thereof
US6761925B2 (en) 1994-12-16 2004-07-13 Canon Kabushiki Kaisha Electron-emitting device, electron source substrate, electron source, display panel and image-forming apparatus, and production method thereof
US7442405B2 (en) 1997-03-21 2008-10-28 Canon Kabushiki Kaisha Method for production of electron source substrate provided with electron emitting element and method for production of electronic device using the substrate
WO1999060829A3 (en) * 1998-05-20 2003-04-17 Intermec Ip Corp Method and apparatus for making electrical traces, circuits and devices
US7354794B2 (en) 2005-02-18 2008-04-08 Lexmark International, Inc. Printed conductive connectors

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