JPS6467320A - Evaluation method for fluid analysis in molding of molten material - Google Patents
Evaluation method for fluid analysis in molding of molten materialInfo
- Publication number
- JPS6467320A JPS6467320A JP62223074A JP22307487A JPS6467320A JP S6467320 A JPS6467320 A JP S6467320A JP 62223074 A JP62223074 A JP 62223074A JP 22307487 A JP22307487 A JP 22307487A JP S6467320 A JPS6467320 A JP S6467320A
- Authority
- JP
- Japan
- Prior art keywords
- molten material
- filling
- pressure
- resin
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
PURPOSE:To judge proper pressure for a molten material to the molten material temperature and also the range of filling time by analyzing the pressure condition for the molten material by means of analyses on variation of a plurality of filling times and graphically displaying function for the maximum pressure for the molten material of respective elements basing on the variation of filling times as variables resulted from computation of pressure distribution of molten material obtained from the analyses. CONSTITUTION:The finite element method is applied for the purpose of resin fluid analysis in a mold. The mold temperature is fixed and three kinds of resin temperature, for instance, 200 deg.C, 220 deg.C and 260 deg.C, are selected, and the filling time is varied for respective temperatures in five kinds, namely 0.2, 0.5, 1, 2 and 3sec, and analysis is computed in order one by one. The maximum resin pressure of respective elements of a shape model is put out by utilizing resin process distribution data at the time of completion of filling obtained as a result, and used as the data in said filling times. A characteristic curve diagram is provided by making a graph of the data obtained by repeating above-said procedures. Further, a proper molding condition can be selected by graphically displaying said diagram in a display device.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62223074A JPS6467320A (en) | 1987-09-08 | 1987-09-08 | Evaluation method for fluid analysis in molding of molten material |
| DE3830571A DE3830571A1 (en) | 1987-09-08 | 1988-09-08 | Method of calculation for flow analysis in injection moulding |
| KR1019880015438A KR970000927B1 (en) | 1987-09-08 | 1988-11-23 | Evaluation method of flow analysis on molding of a molten material |
| US07/595,770 US5097431A (en) | 1987-09-08 | 1990-10-10 | Evaluation method of flow analysis on molding of a molten material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62223074A JPS6467320A (en) | 1987-09-08 | 1987-09-08 | Evaluation method for fluid analysis in molding of molten material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6467320A true JPS6467320A (en) | 1989-03-14 |
| JPH0469852B2 JPH0469852B2 (en) | 1992-11-09 |
Family
ID=16792426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62223074A Granted JPS6467320A (en) | 1987-09-08 | 1987-09-08 | Evaluation method for fluid analysis in molding of molten material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6467320A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07333076A (en) * | 1994-06-06 | 1995-12-22 | Nec Corp | Stress analysis system and method for semiconductor package design |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6234282A (en) * | 1985-08-08 | 1987-02-14 | Hitachi Ltd | Molding process simulation system |
-
1987
- 1987-09-08 JP JP62223074A patent/JPS6467320A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6234282A (en) * | 1985-08-08 | 1987-02-14 | Hitachi Ltd | Molding process simulation system |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07333076A (en) * | 1994-06-06 | 1995-12-22 | Nec Corp | Stress analysis system and method for semiconductor package design |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0469852B2 (en) | 1992-11-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |