JPS6467994A - Circuit board assembly - Google Patents

Circuit board assembly

Info

Publication number
JPS6467994A
JPS6467994A JP20304788A JP20304788A JPS6467994A JP S6467994 A JPS6467994 A JP S6467994A JP 20304788 A JP20304788 A JP 20304788A JP 20304788 A JP20304788 A JP 20304788A JP S6467994 A JPS6467994 A JP S6467994A
Authority
JP
Japan
Prior art keywords
pcb
solder
component
circuit board
board assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20304788A
Other languages
English (en)
Inventor
Jiei Ooku Kebuin
Esu Patsuchien Maikeru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEDOUKO SYST Inc
Original Assignee
SEDOUKO SYST Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEDOUKO SYST Inc filed Critical SEDOUKO SYST Inc
Publication of JPS6467994A publication Critical patent/JPS6467994A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP20304788A 1987-08-14 1988-08-15 Circuit board assembly Pending JPS6467994A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US8550887A 1987-08-14 1987-08-14

Publications (1)

Publication Number Publication Date
JPS6467994A true JPS6467994A (en) 1989-03-14

Family

ID=22192081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20304788A Pending JPS6467994A (en) 1987-08-14 1988-08-15 Circuit board assembly

Country Status (2)

Country Link
EP (1) EP0303370A3 (ja)
JP (1) JPS6467994A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110572954A (zh) * 2019-09-11 2019-12-13 苏州汇川技术有限公司 引脚装配导向件及电路板组件

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015207891A1 (de) * 2014-07-07 2016-01-07 Conti Temic Microelectronic Gmbh Elektronische Komponente und Verfahren zur Herstellung einer elektronischen Komponente

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2344555C2 (de) * 1973-09-04 1982-03-11 Siemens AG, 1000 Berlin und 8000 München Schutzvorrichtung für ein elektrisches Bauelement
GB2141879B (en) * 1983-06-01 1988-03-09 Ferranti Plc Manufacture of printed circuit boards
FR2551618B1 (fr) * 1983-09-02 1989-12-01 Inf Milit Spatiale Aeronaut Procede de fabrication d'un circuit imprime a couches enterrees et circuit imprime obtenu par un tel procede

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110572954A (zh) * 2019-09-11 2019-12-13 苏州汇川技术有限公司 引脚装配导向件及电路板组件

Also Published As

Publication number Publication date
EP0303370A3 (en) 1990-05-16
EP0303370A2 (en) 1989-02-15

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