JPS6468606A - Solder shape detecting device - Google Patents

Solder shape detecting device

Info

Publication number
JPS6468606A
JPS6468606A JP22527887A JP22527887A JPS6468606A JP S6468606 A JPS6468606 A JP S6468606A JP 22527887 A JP22527887 A JP 22527887A JP 22527887 A JP22527887 A JP 22527887A JP S6468606 A JPS6468606 A JP S6468606A
Authority
JP
Japan
Prior art keywords
light pattern
connection part
solder connection
shape
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22527887A
Other languages
Japanese (ja)
Inventor
Koji Oka
Moritoshi Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP22527887A priority Critical patent/JPS6468606A/en
Publication of JPS6468606A publication Critical patent/JPS6468606A/en
Pending legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)

Abstract

PURPOSE:To detect the shape of a solder connection part at a high speed by checking the distortion extent of the shape of a light pattern obtained through single-time image pickup operation by the solder shape detecting device. CONSTITUTION:Multiple circular laser light 30 which is converged on a printed circuit board 7 at right angles to the solder connection part 4 by a beam splitter 32 is reflected by the solder connection part 4 and transmitted through the beam splitter 32 to illuminate the light pattern image forming lens 51 of a light pattern detecting means 5. Then the light pattern converged by this lens 51 is picked up by an ITV camera 52 and converted into an electric signal, which is supplied to a microcomputer system 53 and a monitor 54. Here, the monitor 54 displays the light pattern 40 of the solder connection part 4 and a microcomputer system 53 judges whether or not the shape of the solder connection part 4 is normal from the light pattern 40.
JP22527887A 1987-09-10 1987-09-10 Solder shape detecting device Pending JPS6468606A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22527887A JPS6468606A (en) 1987-09-10 1987-09-10 Solder shape detecting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22527887A JPS6468606A (en) 1987-09-10 1987-09-10 Solder shape detecting device

Publications (1)

Publication Number Publication Date
JPS6468606A true JPS6468606A (en) 1989-03-14

Family

ID=16826823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22527887A Pending JPS6468606A (en) 1987-09-10 1987-09-10 Solder shape detecting device

Country Status (1)

Country Link
JP (1) JPS6468606A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0455709A (en) * 1990-06-26 1992-02-24 Matsushita Electric Works Ltd Inspecting method for soldered part of component having lead
JPH04350506A (en) * 1991-05-28 1992-12-04 Matsushita Electric Works Ltd Method for inspecting lead soldering and solder surface
US5448360A (en) * 1992-12-18 1995-09-05 Kabushiki Kaisha Komatsu Seisakusho Three-dimensional image measuring device
JP2008164572A (en) * 2007-01-05 2008-07-17 Nikon Corp Measuring apparatus and measuring method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0455709A (en) * 1990-06-26 1992-02-24 Matsushita Electric Works Ltd Inspecting method for soldered part of component having lead
JPH04350506A (en) * 1991-05-28 1992-12-04 Matsushita Electric Works Ltd Method for inspecting lead soldering and solder surface
US5448360A (en) * 1992-12-18 1995-09-05 Kabushiki Kaisha Komatsu Seisakusho Three-dimensional image measuring device
JP2008164572A (en) * 2007-01-05 2008-07-17 Nikon Corp Measuring apparatus and measuring method

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