JPS6468937A - Chip-map formation - Google Patents
Chip-map formationInfo
- Publication number
- JPS6468937A JPS6468937A JP22519087A JP22519087A JPS6468937A JP S6468937 A JPS6468937 A JP S6468937A JP 22519087 A JP22519087 A JP 22519087A JP 22519087 A JP22519087 A JP 22519087A JP S6468937 A JPS6468937 A JP S6468937A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- wafer
- center
- point
- vicinity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
- 239000000523 sample Substances 0.000 abstract 2
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE:To specify a chip at an outer end and to shorten a computing time for determining the effectiveness of the chip, by obtaining positional relation of each chip with respect to a wafer, based on the position of center of the wafer, the radius of the wafer, the position of one chip in the vicinity of the center of the wafer and index sizes in the directions of (x) and (y), which are set beforehand. CONSTITUTION:The position of a center 1 of a chip in the vicinity of the center of a wafer is expressed with coordinates X and Y of a position, where an X stage 11 and a Y stage 12 are driven and the probe of a probe card 20 agrees with the bonding pad of the chip in the vicinity of the wafer. The position of a wafer center 2 and a radius R of the wafer are measured by using an electrostatic sensor 17, a camera 18 and an image recognizing device 24. A chip map is formed based on these data. At first, an intersection O (Ox, Oy), which is obtained by extending the center of the outermost chip leftward viewed from the directions of (x) and (y), is obtained by the expression l. Then a point S (nt, m1) at the upper left part, which is moved from the point 0 in the directions (x) and (y) by every 1/2 index, is computed. This point is a starting point for obtaining the position of the chip at the outer end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22519087A JPS6468937A (en) | 1987-09-10 | 1987-09-10 | Chip-map formation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22519087A JPS6468937A (en) | 1987-09-10 | 1987-09-10 | Chip-map formation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6468937A true JPS6468937A (en) | 1989-03-15 |
Family
ID=16825377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22519087A Pending JPS6468937A (en) | 1987-09-10 | 1987-09-10 | Chip-map formation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6468937A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0580895A3 (en) * | 1992-07-24 | 1994-03-09 | Fujitsu Ltd | |
| JP2007281340A (en) * | 2006-04-11 | 2007-10-25 | Jeol Ltd | Semiconductor wafer edge inspection system |
-
1987
- 1987-09-10 JP JP22519087A patent/JPS6468937A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0580895A3 (en) * | 1992-07-24 | 1994-03-09 | Fujitsu Ltd | |
| JP2007281340A (en) * | 2006-04-11 | 2007-10-25 | Jeol Ltd | Semiconductor wafer edge inspection system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7013039B2 (en) | Image processing method, an image processing device and a bonding apparatus | |
| US7146029B2 (en) | Chip carrier for fingerprint sensor | |
| JPH06342822A (en) | Target bonding point automatic teaching method | |
| JP2002208010A (en) | Image processing method and apparatus | |
| US6917699B2 (en) | Image processing method, an image processing device and a bonding apparatus | |
| JPH05340709A (en) | Three-dimensional shape measuring device | |
| US7324683B2 (en) | Bonding pattern discrimination device | |
| JPH067561B2 (en) | Positioning method for semiconductor wafer chips | |
| JPS63108736A (en) | Wafer prober | |
| JPS6261340A (en) | Detecting device for necessary positioning angle of wafer | |
| JP2679236B2 (en) | Non-contact type shape measuring device | |
| JPS6427886A (en) | Method of recognizing body | |
| JPS577134A (en) | Recognition apparatus | |
| JP2568125B2 (en) | Bonding device tool / camera offset amount detection mechanism and method | |
| JPS57198641A (en) | Pattern detection | |
| JP2694462B2 (en) | Positioning method for semiconductor wafer chips | |
| JPH07335722A (en) | Substrate alignment method | |
| JPS6412091B2 (en) | ||
| JPS612081A (en) | Probing device | |
| JPS63252436A (en) | Ultrasonic wedge bonder | |
| JPH0521144Y2 (en) | ||
| JPH085826Y2 (en) | IC card module substrate | |
| JPH09139363A (en) | Wafer block dicing system | |
| JPS5942039U (en) | Semiconductor parts assembly equipment | |
| JPH0445063B2 (en) |