JPS6469015A - Wafer drying apparatus - Google Patents
Wafer drying apparatusInfo
- Publication number
- JPS6469015A JPS6469015A JP22761587A JP22761587A JPS6469015A JP S6469015 A JPS6469015 A JP S6469015A JP 22761587 A JP22761587 A JP 22761587A JP 22761587 A JP22761587 A JP 22761587A JP S6469015 A JPS6469015 A JP S6469015A
- Authority
- JP
- Japan
- Prior art keywords
- air
- wafers
- wafer
- drying apparatus
- fed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001035 drying Methods 0.000 title abstract 4
- 235000012431 wafers Nutrition 0.000 abstract 9
- 238000007664 blowing Methods 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- 230000003749 cleanliness Effects 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
Landscapes
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
PURPOSE:To provide a wafer drying apparatus capable of providing both blowing and vaporizing actions so that water on the wafer surface can be removed quickly and effectively and still capable of enabling batch processing, by feeding clean air into a drying chamber and blowing it against the wafers as the air is heated. CONSTITUTION:Air forcibly fed by a fan 2 is cleaned by a HEPA filter 1. The air is thereby provided with cleanliness class of 100 or below. This air 10 is heated by a heater 3 attached to the side face of a wafer drying apparatus and fed to wafers 7 arranged on a wafer stand 8. The heater 3 is controlled by a PID thyristor and a temperature sensor 11 disposed close to the wafers so that air can be fed to the wafers 7 at a constant temperature. Water drops blown off from the wafers 7 pass through a drain board 4 and are discharged from a drain hole 6, while vapor or air is discharged through an air discharge hole 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22761587A JPS6469015A (en) | 1987-09-10 | 1987-09-10 | Wafer drying apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22761587A JPS6469015A (en) | 1987-09-10 | 1987-09-10 | Wafer drying apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6469015A true JPS6469015A (en) | 1989-03-15 |
Family
ID=16863709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22761587A Pending JPS6469015A (en) | 1987-09-10 | 1987-09-10 | Wafer drying apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6469015A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8393091B2 (en) | 2007-02-21 | 2013-03-12 | Fujitsu Semiconductor Limited | Substrate processing method, and method of manufacturing semiconductor device |
| JP2020176786A (en) * | 2019-04-19 | 2020-10-29 | 株式会社Ｓｃｒｅｅｎ Ｓｐｅ テック | Drying device |
| CN112176409A (en) * | 2020-09-29 | 2021-01-05 | 江西制造职业技术学院 | A apparatus for producing for preparing tic whisker |
-
1987
- 1987-09-10 JP JP22761587A patent/JPS6469015A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8393091B2 (en) | 2007-02-21 | 2013-03-12 | Fujitsu Semiconductor Limited | Substrate processing method, and method of manufacturing semiconductor device |
| US8598023B2 (en) | 2007-02-21 | 2013-12-03 | Fujitsu Semiconductor Limited | Substrate processing apparatus, substrate processing method, and method of manufacturing semiconductor device |
| JP2020176786A (en) * | 2019-04-19 | 2020-10-29 | 株式会社Ｓｃｒｅｅｎ Ｓｐｅ テック | Drying device |
| CN112176409A (en) * | 2020-09-29 | 2021-01-05 | 江西制造职业技术学院 | A apparatus for producing for preparing tic whisker |
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