JPS6471088A - Manufacture of wiring board provided with lead pin - Google Patents

Manufacture of wiring board provided with lead pin

Info

Publication number
JPS6471088A
JPS6471088A JP22548287A JP22548287A JPS6471088A JP S6471088 A JPS6471088 A JP S6471088A JP 22548287 A JP22548287 A JP 22548287A JP 22548287 A JP22548287 A JP 22548287A JP S6471088 A JPS6471088 A JP S6471088A
Authority
JP
Japan
Prior art keywords
lead pin
wiring board
board
punch
shearing area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22548287A
Other languages
Japanese (ja)
Inventor
Hidetoshi Yokoi
Tetsuya Takahashi
Haruki Yokono
Takuya Yasuoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP22548287A priority Critical patent/JPS6471088A/en
Publication of JPS6471088A publication Critical patent/JPS6471088A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H05K3/308—Adaptations of leads

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)

Abstract

PURPOSE:To facilitate lead pin erection on a wiring board and form a wiring board provided with a lead pin in good productivity by adding vibration load op the upper and lower faces of a wiring board through a couple of lead pin and punch which and opposed to each other so as to bore a through hole on the board, and fixing the lead pin left, and then performing circuit processing such as soldering with a copper foil, etc. CONSTITUTION:Required load is added, through dies 2 and 3 by a press, to a wiring board being a board where a laminate and a required circuit pattern are formed so as to cramp the upper and lower faces of the wiring board. Next, vibrations are added to upper and lower punches 4, 5 at the same stroke and energy is supplied to the board shearing area under the boundary between a die hole and the punch. The shearing area is heated partially by the supplied energy. Next, this heat-softened area is sheared and separated and a pulled residuum in the board is pulled down. Next, the upper punch 4 is displaced and then the punch vibration is stopped. The upper punch 4 doubles as a lead pin, and when partial heating of the shearing area stops and the board is cooled, the lead pin and the wiring board are fixed and the copper foil and the lead pin are soldered and electroplated.
JP22548287A 1987-09-09 1987-09-09 Manufacture of wiring board provided with lead pin Pending JPS6471088A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22548287A JPS6471088A (en) 1987-09-09 1987-09-09 Manufacture of wiring board provided with lead pin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22548287A JPS6471088A (en) 1987-09-09 1987-09-09 Manufacture of wiring board provided with lead pin

Publications (1)

Publication Number Publication Date
JPS6471088A true JPS6471088A (en) 1989-03-16

Family

ID=16830017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22548287A Pending JPS6471088A (en) 1987-09-09 1987-09-09 Manufacture of wiring board provided with lead pin

Country Status (1)

Country Link
JP (1) JPS6471088A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03102791A (en) * 1989-09-18 1991-04-30 Yazaki Corp Manufacturing method of printed wiring board
CN103920806A (en) * 2014-03-20 2014-07-16 成都市龙泉驿区齐盛机械厂 High-precision burr-free stamping die

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03102791A (en) * 1989-09-18 1991-04-30 Yazaki Corp Manufacturing method of printed wiring board
CN103920806A (en) * 2014-03-20 2014-07-16 成都市龙泉驿区齐盛机械厂 High-precision burr-free stamping die

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