JPS6471153A - Socket for ic - Google Patents

Socket for ic

Info

Publication number
JPS6471153A
JPS6471153A JP22642387A JP22642387A JPS6471153A JP S6471153 A JPS6471153 A JP S6471153A JP 22642387 A JP22642387 A JP 22642387A JP 22642387 A JP22642387 A JP 22642387A JP S6471153 A JPS6471153 A JP S6471153A
Authority
JP
Japan
Prior art keywords
package
width
adapter
fixed
sops
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22642387A
Other languages
Japanese (ja)
Inventor
Kazunari Ozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP22642387A priority Critical patent/JPS6471153A/en
Publication of JPS6471153A publication Critical patent/JPS6471153A/en
Pending legal-status Critical Current

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  • Connecting Device With Holders (AREA)

Abstract

PURPOSE:To test SOPs in different width by using one socket body, and to decrease the mandays of IC tests for packages by employing a fixed adapter formed conformed to the width of the SOPs (single-outline-package). CONSTITUTION:A contact 21 with lead contacting sections 21a brought into contact with the nose sections 13a of leads 13 for a package is arranged oppositely to a socket body 20. A distance (a) between the noses 21b of the opposed lead contacting sections 21a is set at a value equal to the width of the package in applied minimum width. A distance (b) between rear ends 21c on the reverse sides of the noses is set in length acquired by adding the lead length of the package to the width of the package in applied maximum width. A package receiving recessed section 24 in width equal to the different width of the applied package is shaped to a fixed adapter 23 fitted to a fixed-adapter receiving recessed section 22 in the body 20. The package is engaged with the adapter 23 fitted to the body 20, and a specified IC test is executed.
JP22642387A 1987-09-11 1987-09-11 Socket for ic Pending JPS6471153A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22642387A JPS6471153A (en) 1987-09-11 1987-09-11 Socket for ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22642387A JPS6471153A (en) 1987-09-11 1987-09-11 Socket for ic

Publications (1)

Publication Number Publication Date
JPS6471153A true JPS6471153A (en) 1989-03-16

Family

ID=16844891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22642387A Pending JPS6471153A (en) 1987-09-11 1987-09-11 Socket for ic

Country Status (1)

Country Link
JP (1) JPS6471153A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0451479A (en) * 1990-06-19 1992-02-19 Enplas Corp Manufacture of contact pin
KR20010084797A (en) * 2000-02-29 2001-09-06 박종섭 Socket for semiconductor package test

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0451479A (en) * 1990-06-19 1992-02-19 Enplas Corp Manufacture of contact pin
KR20010084797A (en) * 2000-02-29 2001-09-06 박종섭 Socket for semiconductor package test

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