JPS6472700A - Ultrasonic transducer and its manufacture - Google Patents
Ultrasonic transducer and its manufactureInfo
- Publication number
- JPS6472700A JPS6472700A JP22829187A JP22829187A JPS6472700A JP S6472700 A JPS6472700 A JP S6472700A JP 22829187 A JP22829187 A JP 22829187A JP 22829187 A JP22829187 A JP 22829187A JP S6472700 A JPS6472700 A JP S6472700A
- Authority
- JP
- Japan
- Prior art keywords
- metallic film
- substrate
- film
- wave
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 6
- 239000004065 semiconductor Substances 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Landscapes
- Transducers For Ultrasonic Waves (AREA)
- Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
Abstract
PURPOSE:To set a characteristic to uniform, highly sensitive, miniature and light by forming a first electrode so that it covers an opening hole provided on a substrate different from a semiconductor substrate and adhering the substrate and the semiconductor substrate. CONSTITUTION:A metallic film 10 is adhered to a glass substrate 20 and it transmits and receives an ultrasonic wave through the opening hole 22. At the same time, it has a function as an electrically upper electrode. The metallic film 10 vertically vibrates on the etching hole 12 of a non-through hole, which is made in a silicon substrate 1, and the ultrasonic wave is transmitted and received. The metallic film 10 as an upper electrode and a lower electrode 6 are arranged on both sides of an oxide film 36 provided under the metallic film 10, and an AC voltage is impressed on lead electrodes 25 and 26 which are integrally formed with the metallic film and the lower electrode 6 so as to vibrate the metellic film 10 at the time of transmitting the wave. At the time of wave-reception on the other hand, the generation of the AC voltage in the lead electrodes 25 and 26 by the vibration of the metallic film 10 is used. Thus, a highly sensitive, miniature and light integration ultrasonic transducer, which has less fluctuation in the characteristic, can be obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22829187A JPS6472700A (en) | 1987-09-14 | 1987-09-14 | Ultrasonic transducer and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22829187A JPS6472700A (en) | 1987-09-14 | 1987-09-14 | Ultrasonic transducer and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6472700A true JPS6472700A (en) | 1989-03-17 |
| JPH0552120B2 JPH0552120B2 (en) | 1993-08-04 |
Family
ID=16874166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22829187A Granted JPS6472700A (en) | 1987-09-14 | 1987-09-14 | Ultrasonic transducer and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6472700A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4865832A (en) * | 1984-09-14 | 1989-09-12 | Alps Electric Co., Ltd. | Molybdenum oxide whiskers and a method of producing the same |
| JP2010507932A (en) * | 2006-10-23 | 2010-03-11 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Symmetrically and selectively oriented random arrays for ultrasound therapy |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61220600A (en) * | 1985-03-26 | 1986-09-30 | Nec Corp | Ultrasonic wave sensor |
| JPS62149299A (en) * | 1985-12-24 | 1987-07-03 | Agency Of Ind Science & Technol | Array type ultrasonic transducer |
-
1987
- 1987-09-14 JP JP22829187A patent/JPS6472700A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61220600A (en) * | 1985-03-26 | 1986-09-30 | Nec Corp | Ultrasonic wave sensor |
| JPS62149299A (en) * | 1985-12-24 | 1987-07-03 | Agency Of Ind Science & Technol | Array type ultrasonic transducer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4865832A (en) * | 1984-09-14 | 1989-09-12 | Alps Electric Co., Ltd. | Molybdenum oxide whiskers and a method of producing the same |
| JP2010507932A (en) * | 2006-10-23 | 2010-03-11 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Symmetrically and selectively oriented random arrays for ultrasound therapy |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0552120B2 (en) | 1993-08-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW366548B (en) | Trench bump block and the application of the same | |
| JPS5472696A (en) | Package for super miniature size piezoelectric oscillator | |
| CA2105258A1 (en) | Piezoelectric Semiconductor and Process for Production Thereof | |
| FR2458150A1 (en) | Rectangular piezoelectric crystal of resonator - has surface electrode and corner metallisations soldered to corresp. metallisations on base, two serving as external contacts | |
| US4110640A (en) | Standard signal generating apparatus | |
| JPS5773513A (en) | Surface acoustic wave device | |
| JPS6411354A (en) | Sealing structure of electronic circuit | |
| JPS6450595A (en) | Connection of semiconductor device | |
| GB1507171A (en) | Surface wave apparatus | |
| EP0081419A3 (en) | High lead count hermetic mass bond integrated circuit carrier | |
| JPS5357971A (en) | Production of semiconductor device | |
| JPS62199108A (en) | Composite surface acoustic wave device | |
| JPS55110924A (en) | Integrated construction type vibration detecter | |
| JPS5837200Y2 (en) | Sealed button piezoelectric sounding element | |
| JPS57135330A (en) | Stress converter | |
| JPH0329498A (en) | Enclosure with ultrasonic wave transducer mounted thereto and mount method | |
| JPS55148449A (en) | Semiconductor device | |
| JPH04782A (en) | Package for semiconductor laser | |
| JPS6316076A (en) | Electrode fixture for ultrasonic piezoelectric vibrator | |
| JPS56137664A (en) | Lead frame and semiconductor device having lead frame | |
| JPS57138146A (en) | Attaching method for pellet | |
| JPS57136363A (en) | Composite semiconductor device | |
| JPS6022719Y2 (en) | ultrasonic transducer | |
| JPS64518A (en) | Liquid crystal display element | |
| JPS5661678A (en) | Indicating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |