JPS6472974A - Joined body of ceramics nitride and metal - Google Patents

Joined body of ceramics nitride and metal

Info

Publication number
JPS6472974A
JPS6472974A JP23079687A JP23079687A JPS6472974A JP S6472974 A JPS6472974 A JP S6472974A JP 23079687 A JP23079687 A JP 23079687A JP 23079687 A JP23079687 A JP 23079687A JP S6472974 A JPS6472974 A JP S6472974A
Authority
JP
Japan
Prior art keywords
metal
ceramics
nitride
cermet
expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23079687A
Other languages
Japanese (ja)
Inventor
Makoto Okabayashi
Toshikuni Kusano
Minoru Takahashi
Masami Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aisin Corp
Original Assignee
Aisin Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aisin Seiki Co Ltd filed Critical Aisin Seiki Co Ltd
Priority to JP23079687A priority Critical patent/JPS6472974A/en
Publication of JPS6472974A publication Critical patent/JPS6472974A/en
Pending legal-status Critical Current

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  • Ceramic Products (AREA)

Abstract

PURPOSE:To prevent the breakage of ceramics nitride and metal by residual stress with the excellent thermal relieving capacity and to strongly join both by placing cermet or cermet and low-expansion metal in place between the ceramics nitride and the metal, then joining the ceramics and the metal. CONSTITUTION:The joining material which consists of the cermet having a compsn. range of (a) 10wt.%<Ti<20wt.%, Ni>10wt.%, and <10wt.% others and the balance MgO or the low expansion metal consisting of the component (a) and (b) 'Cobal(R)', etc., and having the coefft. expansion within 3X10<-6>(deg<-1>) (0-400 deg.C) and >=1,200 deg.C m.p. is held in place between (A) the ceramics nitride such as Al3N4 and (B) the metal, then both are joined.
JP23079687A 1987-09-14 1987-09-14 Joined body of ceramics nitride and metal Pending JPS6472974A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23079687A JPS6472974A (en) 1987-09-14 1987-09-14 Joined body of ceramics nitride and metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23079687A JPS6472974A (en) 1987-09-14 1987-09-14 Joined body of ceramics nitride and metal

Publications (1)

Publication Number Publication Date
JPS6472974A true JPS6472974A (en) 1989-03-17

Family

ID=16913407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23079687A Pending JPS6472974A (en) 1987-09-14 1987-09-14 Joined body of ceramics nitride and metal

Country Status (1)

Country Link
JP (1) JPS6472974A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH038732U (en) * 1989-06-14 1991-01-28
US5362592A (en) * 1991-11-14 1994-11-08 Showa Denko K.K. Decolorizable toner
WO2020044593A1 (en) * 2018-08-28 2020-03-05 三菱マテリアル株式会社 Copper/ceramic bonded body, insulation circuit board, method for producing copper/ceramic bonded body, and method for manufacturing insulation circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH038732U (en) * 1989-06-14 1991-01-28
US5362592A (en) * 1991-11-14 1994-11-08 Showa Denko K.K. Decolorizable toner
WO2020044593A1 (en) * 2018-08-28 2020-03-05 三菱マテリアル株式会社 Copper/ceramic bonded body, insulation circuit board, method for producing copper/ceramic bonded body, and method for manufacturing insulation circuit board
JPWO2020045388A1 (en) * 2018-08-28 2021-08-26 三菱マテリアル株式会社 A method for manufacturing a copper / ceramics joint, an insulating circuit board, and a copper / ceramics joint, and a method for manufacturing an insulated circuit board.
US11396059B2 (en) 2018-08-28 2022-07-26 Mitsubishi Materials Corporation Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method

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