JPS6473732A - Bonding device - Google Patents

Bonding device

Info

Publication number
JPS6473732A
JPS6473732A JP62233106A JP23310687A JPS6473732A JP S6473732 A JPS6473732 A JP S6473732A JP 62233106 A JP62233106 A JP 62233106A JP 23310687 A JP23310687 A JP 23310687A JP S6473732 A JPS6473732 A JP S6473732A
Authority
JP
Japan
Prior art keywords
data
stored
image
corrected
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62233106A
Other languages
Japanese (ja)
Other versions
JPH071771B2 (en
Inventor
Tadao Yasusato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62233106A priority Critical patent/JPH071771B2/en
Publication of JPS6473732A publication Critical patent/JPS6473732A/en
Publication of JPH071771B2 publication Critical patent/JPH071771B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To eliminate an individual difference due to an operator and to shorten a detecting time by a method wherein the position of a point set as a reference is held as the data on position and a bonding is performed while the correction of the data on the position of the center of rotation of a bonding stage is performed. CONSTITUTION:A camera 19 is moved with the feature of an IC chip as a mark while an image to be projected by the camera 19 is seen, the central point of a crossline on a monitor is superposed on the marked point, this image is stored as a first image data and moreover, the position of the marked point is stored as the data on position. Then, a bonding stage 14 is rotated at 180 deg., the image is stored as a second image data in the same way as the above way and moreover, the marked position is stored as the data on position. Then, the second image data is compared with the first image data stored by an image processor 15 during a bonding work, the amount of deviation is detected, the position of the marked point on the IC chip is corrected and the corrected position is stored as the corrected data on position. Then, the stage is rotated at 180 deg. and the same operation as the above one is performed. Moreover, the position of the center to rotation of the stage 14 is calculated from the corrected data.
JP62233106A 1987-09-16 1987-09-16 Bonding device Expired - Lifetime JPH071771B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62233106A JPH071771B2 (en) 1987-09-16 1987-09-16 Bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62233106A JPH071771B2 (en) 1987-09-16 1987-09-16 Bonding device

Publications (2)

Publication Number Publication Date
JPS6473732A true JPS6473732A (en) 1989-03-20
JPH071771B2 JPH071771B2 (en) 1995-01-11

Family

ID=16949867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62233106A Expired - Lifetime JPH071771B2 (en) 1987-09-16 1987-09-16 Bonding device

Country Status (1)

Country Link
JP (1) JPH071771B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068787A (en) * 2001-08-23 2003-03-07 Kaijo Corp Bonding equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068787A (en) * 2001-08-23 2003-03-07 Kaijo Corp Bonding equipment

Also Published As

Publication number Publication date
JPH071771B2 (en) 1995-01-11

Similar Documents

Publication Publication Date Title
JPS6465848A (en) Alignment
JP3839061B2 (en) Method for arranging components on a substrate and component arrangement machine for carrying out this method
EP0326236A3 (en) Method of setting up apparatus for handling electrical or electronic components
EP0234772A3 (en) Apparatus for aligning objects
CA1027255A (en) Method and apparatus for detecting a registration mark on a target such as a semiconductor wafer
JPS6483103A (en) Method for correcting position coordinates of workpiece
JPS6473732A (en) Bonding device
ATE77424T1 (en) SEWING MACHINE WITH COMPUTER.
JPS5816532A (en) Positioning device
JPS6464334A (en) Apparatus for mounting semiconductor wafer
JPS55125641A (en) Automatic chip selection apparatus
JPS6472873A (en) Registering method for belt-shaped film
JP3332442B2 (en) Nuclear medicine diagnostic equipment
JPS5715434A (en) Bonding apparatus
JPS5993243A (en) assembly equipment
JPS60239602A (en) How to correct the deviation between the center of the tip of the stylus of a touch sensor and the center of the main axis
JP3603554B2 (en) Automatic teaching method of rotation angle of transfer head in electronic component mounting device
JPS5450267A (en) Automatic wire bonding method
JPS5283295A (en) Handling method for troubles in ticket examining machines based on tic ket read errors, etc.
JPS6353411A (en) Work measuring apparatus
JPH03287347A (en) Alignment method and its device
JPS53570A (en) Aligning apparatus for rod-like articles
JPH018962Y2 (en)
JPS539184A (en) Automatic unbalance correcting apparatus
JPS57206040A (en) Wire bonding method