JPS647529A - Semiconductor device and mounting thereof - Google Patents

Semiconductor device and mounting thereof

Info

Publication number
JPS647529A
JPS647529A JP62161882A JP16188287A JPS647529A JP S647529 A JPS647529 A JP S647529A JP 62161882 A JP62161882 A JP 62161882A JP 16188287 A JP16188287 A JP 16188287A JP S647529 A JPS647529 A JP S647529A
Authority
JP
Japan
Prior art keywords
leads
lead holding
holding frames
parts
film tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62161882A
Other languages
Japanese (ja)
Inventor
Yutaka Okuaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP62161882A priority Critical patent/JPS647529A/en
Publication of JPS647529A publication Critical patent/JPS647529A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent outer leads form deforming by a method wherein a lead holding part comprising inner lead holding frames and outer lead holding frames is formed on a film tape furthermore guide holes are formed. CONSTITUTION:Guide holes 24 are formed on the parts near four corner parts of a film tape 21. Besides, multiple leads 25 comprising copper foils etc., are formed in four directions on the film tape 21 while the parts near the ends of inner lead parts 25-1 of the leads 25 are connected to a semiconductor elements 26 contained in an opening part 22. Furthermore, the inner leads 25-1 are mutually linked and held with one another by inner lead holding frames 23-1 around the opening 22. On the other hand, the parts near the ends of outer leads 25-2 are linked and held with one another by outer lead holding frames 23-2. In such manner, the outer leads 25-2 vulnerable to deformation can be surely prevented from deforming.
JP62161882A 1987-06-29 1987-06-29 Semiconductor device and mounting thereof Pending JPS647529A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62161882A JPS647529A (en) 1987-06-29 1987-06-29 Semiconductor device and mounting thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62161882A JPS647529A (en) 1987-06-29 1987-06-29 Semiconductor device and mounting thereof

Publications (1)

Publication Number Publication Date
JPS647529A true JPS647529A (en) 1989-01-11

Family

ID=15743782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62161882A Pending JPS647529A (en) 1987-06-29 1987-06-29 Semiconductor device and mounting thereof

Country Status (1)

Country Link
JP (1) JPS647529A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5341213A (en) * 1992-07-21 1994-08-23 Avco Corporation Alignment of radiation receptor with lens by Fourier optics
JPH09191025A (en) * 1995-05-08 1997-07-22 Fujitsu Ltd IC support film positioning method and IC chip test method using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5341213A (en) * 1992-07-21 1994-08-23 Avco Corporation Alignment of radiation receptor with lens by Fourier optics
JPH09191025A (en) * 1995-05-08 1997-07-22 Fujitsu Ltd IC support film positioning method and IC chip test method using the same

Similar Documents

Publication Publication Date Title
MY103475A (en) Electronic device package with peripheral carrier structure of a different material
DE3172466D1 (en) Structure and process for fabricating an integrated circuit
DE3379621D1 (en) Semiconductor integrated circuit device and a method for manufacturing the same
MY8700804A (en) A semiconductor integrated circuit device and method of manufacturing the same
EP0239958A3 (en) Thin film semiconductor device and method of manufacturing the same
SG47613A1 (en) Semiconductor device having an improved lead arrangement and method for manufacturing the same
GB2195826B (en) A lead frame for a semiconductor device and a method for manufacturing a semiconductor device using the lead frame
EP0117111A3 (en) Semiconductor device assembly and package
EP0154337A3 (en) Transistor circuit for semiconductor device with hysteresis operation and manufacturing method therefor
GB2083000B (en) Package for electrical and/or electronic components
DE3363539D1 (en) Method of growing an alloy film by a layer-by-layer process on a substrate, and a method of making a semiconductor device
DE3071715D1 (en) Semiconductor integrated circuit and wiring method therefor
GB2154792B (en) Single-in-line integrated electronic component package
DE3176292D1 (en) Substrate and integrated circuit module with this substrate
DE3380104D1 (en) Substrate structure of semiconductor device and method of manufacturing the same
JPS52156559A (en) Small electronic device packaging package
JPS54124677A (en) Semiconductor device
GB2088627B (en) Semiconductor integrated circuit device and fabrication method thereof
KR870700274A (en) Improved lead frame and method for manufacturing plastic capsule semiconductor device using the same
JPS5635447A (en) Leadless integrated circuit package and method therefor
GB2056772B (en) Integrated circuit package and module
MY8600559A (en) Semiconductor integrated circuit device and fabrication method thereof
JPS54147780A (en) Carrier tape
JPS54102971A (en) Semiconductor device
JPS645895A (en) Tape carrier