JPS6475300A - Method of transferring pottery requiring no baking - Google Patents
Method of transferring pottery requiring no bakingInfo
- Publication number
- JPS6475300A JPS6475300A JP23309887A JP23309887A JPS6475300A JP S6475300 A JPS6475300 A JP S6475300A JP 23309887 A JP23309887 A JP 23309887A JP 23309887 A JP23309887 A JP 23309887A JP S6475300 A JPS6475300 A JP S6475300A
- Authority
- JP
- Japan
- Prior art keywords
- pattern layer
- transfer paper
- water soluble
- water
- soluble glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 6
- 239000003292 glue Substances 0.000 abstract 4
- 239000000463 material Substances 0.000 abstract 3
- 230000002787 reinforcement Effects 0.000 abstract 3
- 239000000853 adhesive Substances 0.000 abstract 2
- 238000001354 calcination Methods 0.000 abstract 1
- 210000003298 dental enamel Anatomy 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000003973 paint Substances 0.000 abstract 1
- 239000000049 pigment Substances 0.000 abstract 1
- 238000007639 printing Methods 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 abstract 1
Landscapes
- Decoration By Transfer Pictures (AREA)
Abstract
PURPOSE: To dispense with intermediate calcination and to obtain good outline transfer, by using a transfer paper prepared by forming a pattern layer including a pigment for pottery on a hygroscopic mount through a water soluble glue layer, and adhering a pattern layer reinforcement material on the pattern layer face by a water-proof adhesive agent. CONSTITUTION: A hygroscopic mount 3 is coated with a water soluble glue 2 liquid, the desired pattern is printed thereon by a screen printing method with the paint for printing, and dried to form a pattern layer 6. Then a pattern layer reinforcement material 9 coated with the water resisting adhesive agent 8 in advance is adhered to the surface of the pattern layer 6 to obtain the transfer paper 5a. The transfer paper 5a is dipped in the water for 2-3 minutes to gelatinize the water soluble glue 2, and placed on a specific position of a base 1 as a matter to be transferred, and the hygroscopic mount 3 is slided and extracted while lightly pressed. Then the transfer paper is dried, so that the pattern layer 6 is stably adhered on the base 1 by a small amount of remained water soluble glue 2. The pattern layer reinforcement material 9 is separated, and the pattern face is colored by the specific enamel color 7 to obtain the product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23309887A JPS6475300A (en) | 1987-09-17 | 1987-09-17 | Method of transferring pottery requiring no baking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23309887A JPS6475300A (en) | 1987-09-17 | 1987-09-17 | Method of transferring pottery requiring no baking |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6475300A true JPS6475300A (en) | 1989-03-20 |
Family
ID=16949749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23309887A Pending JPS6475300A (en) | 1987-09-17 | 1987-09-17 | Method of transferring pottery requiring no baking |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6475300A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0255280A (en) * | 1988-08-19 | 1990-02-23 | Reiko Co Ltd | Production of ceramic form |
| US4924643A (en) * | 1988-02-12 | 1990-05-15 | Carboxyque Francaise | Method and apparatus for the treatment of work pieces by shot blasting |
| US5025597A (en) * | 1987-06-23 | 1991-06-25 | Taiyo Sanso Co., Ltd. | Processing apparatus for semiconductor wafers |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4737206U (en) * | 1971-05-04 | 1972-12-25 | ||
| JPS5218727A (en) * | 1975-08-01 | 1977-02-12 | Hiyougoken | Composite of gypsum and whisker |
-
1987
- 1987-09-17 JP JP23309887A patent/JPS6475300A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4737206U (en) * | 1971-05-04 | 1972-12-25 | ||
| JPS5218727A (en) * | 1975-08-01 | 1977-02-12 | Hiyougoken | Composite of gypsum and whisker |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5025597A (en) * | 1987-06-23 | 1991-06-25 | Taiyo Sanso Co., Ltd. | Processing apparatus for semiconductor wafers |
| US4924643A (en) * | 1988-02-12 | 1990-05-15 | Carboxyque Francaise | Method and apparatus for the treatment of work pieces by shot blasting |
| JPH0255280A (en) * | 1988-08-19 | 1990-02-23 | Reiko Co Ltd | Production of ceramic form |
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