JPS6475663A - Cu plated material having high corrosion resistance and production thereof - Google Patents

Cu plated material having high corrosion resistance and production thereof

Info

Publication number
JPS6475663A
JPS6475663A JP23352187A JP23352187A JPS6475663A JP S6475663 A JPS6475663 A JP S6475663A JP 23352187 A JP23352187 A JP 23352187A JP 23352187 A JP23352187 A JP 23352187A JP S6475663 A JPS6475663 A JP S6475663A
Authority
JP
Japan
Prior art keywords
plated
corrosion resistance
base material
high corrosion
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23352187A
Other languages
Japanese (ja)
Inventor
Kazutoshi Shimogoori
Hiroshi Sato
Masao Toyama
Hidetoshi Nishimoto
Kouki Ikeda
Jiyunji Kawafuku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP23352187A priority Critical patent/JPS6475663A/en
Publication of JPS6475663A publication Critical patent/JPS6475663A/en
Pending legal-status Critical Current

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  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To produce a Cu plated material having superior corrosion resistance when a base material is plated with Cu by vapor deposition, by controlling the temp. of the plated base material to a specified value immediately after the plating. CONSTITUTION:When a base material is plated with Cu by vapor deposition, the temp. of the plated base material is controlled to >=250 deg.C, preferably >=400 deg.C immediately after the plating. The peak intensity ratio of (111) face to (200) face in the X-ray diffraction pattern is increased to >=0.35 and a Cu plated material having high corrosion resistance is produced.
JP23352187A 1987-09-17 1987-09-17 Cu plated material having high corrosion resistance and production thereof Pending JPS6475663A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23352187A JPS6475663A (en) 1987-09-17 1987-09-17 Cu plated material having high corrosion resistance and production thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23352187A JPS6475663A (en) 1987-09-17 1987-09-17 Cu plated material having high corrosion resistance and production thereof

Publications (1)

Publication Number Publication Date
JPS6475663A true JPS6475663A (en) 1989-03-22

Family

ID=16956336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23352187A Pending JPS6475663A (en) 1987-09-17 1987-09-17 Cu plated material having high corrosion resistance and production thereof

Country Status (1)

Country Link
JP (1) JPS6475663A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0565766A3 (en) * 1992-02-20 1995-08-23 Nissin Electric Co Ltd Copper film coated substrate and method of forming copper film on substrate
JP2015101750A (en) * 2013-11-22 2015-06-04 大日本印刷株式会社 Laminate used for producing film sensor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0565766A3 (en) * 1992-02-20 1995-08-23 Nissin Electric Co Ltd Copper film coated substrate and method of forming copper film on substrate
US5501911A (en) * 1992-02-20 1996-03-26 Nissin Electric Co., Ltd. Copper crystal film coated organic substrate
JP2015101750A (en) * 2013-11-22 2015-06-04 大日本印刷株式会社 Laminate used for producing film sensor

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